Industry News: finetech and fineplacer (Page 6 of 10)

Finetech launches a new brand identity at Productronica

Industry News | 2009-12-07 18:50:22.0

Finetech GmbH & Co. KG, manufacturer of SMD rework and micro assembly equipment, will present a new brand identity from November. This stems from a process of change over many years, which is reflected in the sales structures and product range, as well as other areas.

Finetech

Scott Kenter Joins FINETECH as Applications Engineer

Industry News | 2008-09-02 15:26:09.0

FINETECH announces that Scott Kentner has joined the Manchester, NH team as Applications Engineer.

Finetech

Donated Finetech Die Bonder Installed at Pennsylvania State University

Industry News | 2013-03-11 09:10:32.0

A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.

Finetech

Finetech to Demonstrate Compact Rework System at Nepcon East 2007

Industry News | 2007-10-23 16:19:57.0

Tempe, AZ - October 23, 2007 - FINETECH will demonstrate its fixed configuration, complete rework system, at the upcoming Nepcon East exhibition on October 30-31, 2007 at the Boston Convention Center.

Finetech

Pennsylvania State University Wins Finetech Die Bonder Donation

Industry News | 2012-08-29 10:27:05.0

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.

Finetech

FINETECH’s Neil O’Brien to Present at SMTAI 2009

Industry News | 2009-09-17 14:39:48.0

FINETECH’s Neil O’Brien will present “Fine-Pitch QFN Rework — Triple the Challenge in a Lead-Free World” at the upcoming SMTA International at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session SMT4, titled “Challenges and Solutions Relating to the Rework of QFN Packages,” on Wednesday, October 7, 2009 from 8-9:30 a.m.

Finetech

Microtek Adds FINEPLACER® Lambda Die Bonder to New Facility

Industry News | 2016-07-25 15:46:30.0

Finetech, a global supplier of micro-assembly equipment, and Microtek, a microelectronics product development innovator, announce the addition of a FINEPLACER® Lambda bonding system at the recently opened Microtek facility. The die bonder will be used for customized packaging applications in prototype and development projects, including wireless, photonics and medical diagnostics and therapeutics.

Microtek, Inc.

FINETECH/MARTIN to Host SMTA Boston Chapter Meeting

Industry News | 2010-10-06 11:52:25.0

FINETECH/MARTIN announces that it will host the upcoming SMTA Boston Chapter meeting on Tuesday, October 12, 2010 at its facility in Manchester, NH. Joe Belmonte, Principal Consultant at ITM Consulting, will present "Considerations in Miniature SMT Component Assembly."

Finetech

New Infrared Start Sensor for Touchless Board Temperature Measurement

Industry News | 2007-10-29 16:48:09.0

At the Productronica 2007 tradeshow in Munich, Germany, FINETECH will present a new solution for contactless board temperature measurement � the infrared start sensor.

Finetech

FINETECH to Demonstrate Advanced Rework Applications at APEX 2009

Industry News | 2009-03-18 17:08:59.0

FINETECH will demonstrate today's most requested advanced rework applications in booth #2059 at the upcoming APEX 2009, scheduled to take place March 31 � April 2, 2009 at the Mandalay Bay Convention Center in Las Vegas.

Finetech


finetech and fineplacer searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for Selective Soldering Needs

High Throughput Reflow Oven
High Throughput Reflow Oven

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
SMT feeders

Easily dispense fine pitch components with ±25µm positioning accuracy.
Professional technical team,good service, ready to ship- Various brands pick and place machine!

Thermal Transfer Materials.