Industry News: finetech rework station (Page 10 of 38)

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Industry News | 2013-01-16 13:48:03.0

Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO

Finetech

Finetech Shows Support for University Research

Industry News | 2012-02-07 16:16:09.0

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

Finetech

FINETECH to Present at SMT/HYBRID/PACKAGING

Industry News | 2009-04-23 20:46:52.0

FINETECH Product Manager Dominik Horn will give a presentation titled �QFN Rework in OEM Quality� at the upcoming SMT/HYBRID/PACKAGING Exhibition & Conference, scheduled to take place Wednesday, May 6, 2009 from 1:40-2 p.m.

Finetech

New Infrared Start Sensor for Touchless Board Temperature Measurement

Industry News | 2007-10-29 16:48:09.0

At the Productronica 2007 tradeshow in Munich, Germany, FINETECH will present a new solution for contactless board temperature measurement � the infrared start sensor.

Finetech

FINETECH to Showcase Chip-to-Wafer Packaging with Sub-Micron Bonder at Photonics West 2009

Industry News | 2009-01-16 17:14:22.0

FINETECH will showcase chip-to-wafer bonding with the sub-micron placement accuracy FINEPLACER� Femto at the upcoming Photonics West exhibition (booth 519) in San Jose, CA, January 27-29, 2009

Finetech

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

High Accuracy Die Bonder on Display at IMAPS 2009

Industry News | 2009-10-16 19:21:16.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

Finetech

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Industry News | 2010-10-04 16:32:22.0

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

Finetech


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