Industry News | 2009-12-07 20:44:54.0
At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming entry-level rework system, the FINEPLACER® core.
Industry News | 2010-09-08 14:48:03.0
Finetech will highlight the new FINEPLACER® core rework system in distributor SMAtech Brazil‘s booth #317 at the upcoming GEM Expo 2010, scheduled to take place October 5-7, 2010 at the prestigious, state-of-the-art Expo Center Norte in São Paulo, Brazil.
Industry News | 2011-11-20 13:19:41.0
Finetech has been awarded a Global Technology Award in the category of Bonding Equipment for its FINEPLACER® matrix ma.
Industry News | 2013-01-16 13:48:03.0
Finetech will highlight the FINEPLACER® core rework system in booth #1205 at the upcoming IPC APEX EXPO
Industry News | 2008-04-07 21:12:39.0
FINETECH announces FINEVIEW� video microscope station will make its Asian premiere at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China.
Industry News | 2012-02-07 16:16:09.0
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.
Industry News | 2013-11-08 18:07:48.0
Finetech has developed a new high force configuration of the FINEPLACER® pico ma platform targeting leading-edge anisotropic conductive film (ACF) applications.
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2010-10-01 01:05:06.0
Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2007-11-27 12:13:09.0
FINEPLACER� Micro MA is a bonding platform characterized by an enlarged working space (max. substrate size 460 mm x 310 mm) combined with placement accuracy better than 10 micron. The system is suitable for small component assembly with a pitch down to 50 micron.
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