Industry News | 2013-04-12 03:06:59.0
ENGMATEC will present at the SMT 2013 in Nuremberg/Germany a new test concept with a standardized fixture kit for manual test adapters and inline test equipment.
Industry News | 2013-10-11 17:34:05.0
Everett Charles Technologies’ (ECT) today announced that it will exhibit in Stand A1-567 at the 20th international Productronica International Trade Fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2009-11-04 15:38:32.0
The SMART platform offers a test solution for low to mid volume PCB assemblies without high tooling costs.
Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2013-03-29 19:04:15.0
Everett Charles Technologies’ (ECT) today announced that it will exhibit in booth #557 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2018-10-15 18:31:07.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-18 19:55:33.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming IWLPC 2018 – 15th Annual International Wafer-Level Packaging Conference. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging and manufacturing. The event will take place October 23 - 25, 2018 at the DoubleTree by Hilton San Jose in San Jose, CA.
Industry News | 2018-10-02 17:16:16.0
Practical Components announces that it will display its latest technology in booth 827 at the upcoming iMAPS 2018 – Pasadena 51st International Symposium on Microelectronics exhibition and conference, scheduled to take place October 9-11, 2018 at the Pasadena Convention Center in California.
Industry News | 2010-11-30 00:33:05.0
Everett Charles Technologies’ (ECT) Fixture Services Group (FSG) introduces LEDCHECK™VIII, a new assembly for automatically testing the color, wavelength and light intensity, including WHITE color, of LEDs on printed circuit boards (PCBs) while under test.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2002-07-24 15:31:18.0
Easy pin placement and visibility enhance in-line printer repeatability. Transition Automation introduces off-line flexible pin support systems for in-line printing.
