Industry News | 2021-02-17 13:05:46.0
New Flat Pack Series Supplies Twice the Capacitance and Lifetime Hours of Devices in the Same Class
Industry News | 2010-02-11 16:19:54.0
Pomona, CA, February 2010 — Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest semiconductor probes at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.
Industry News | 2018-04-27 09:51:10.0
BTU International announces that it was awarded three 2018 EM Asia Innovation Awards during NEPCON China. The awards were presented to the company for its PYRAMAX™ Vacuum reflow oven, TrueFlat technology and Profile Guardian during an April 25, 2018 ceremony at the Shanghai World Expo Exhibition & Convention Center in China.
Industry News | 2011-03-10 21:52:11.0
The Contact Products Group (CPG) of Everett Charles Technologies will display the Edge™ for the first time in Booth #447 at the upcoming IPC APEX EXPO. The Edge™ provides an economical, sharp, aggressive and shallow angle blade tip for reliable via probing on PCBs by incorporating ECT’s patented ZIP® flat technology manufacturing cost advantages.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2011-05-12 22:07:58.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) launched its new Diamond FP and Ruby high-resolution X-ray inspection systems earlier today at Nepcon Shanghai.
Industry News | 2011-07-26 17:11:30.0
Nanovea introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement.
Industry News | 2012-05-15 08:57:25.0
Practical Components Inc., a leading supplier of dummy components, has introduced a display case containing a sampling of components.
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2011-02-23 20:02:51.0
Everett Charles Technologies’ Contact Products Group (CPG) has been awarded US Patent Number: 7,862,391for its ZIP® family of flat technology Pogo® pins.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2014-10-15 15:51:37.0
Etek Europe Ltd. are proud to announce the installation of a Nordson DAGE Diamond Flat Panel with X-Place and CT Options to NI Hungary.
.gif)
winsouce.jpg)