Industry News: flats (Page 10 of 50)

Best Technical Papers at IPC APEX EXPO 2022 Selected

Industry News | 2022-01-14 17:06:40.0

Expanded technical conference award categories include NextGen and Student Research

Association Connecting Electronics Industries (IPC)

VOLUNTEERS HONORED FOR CONTRIBUTIONS TO ELECTRONICS INDUSTRY AND IPC More than 150 awards presented at IPC APEX EXPO 2014

Industry News | 2014-03-28 09:54:48.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

New Kapton Film Stencils for Labs and DIYs

Industry News | 2014-01-17 12:52:25.0

BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.

BEST Inc.

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

Worlds Largest Circuit Board

Industry News | 2015-01-09 11:11:22.0

BEST solder training and certification vehicle now outfitted with PCB "skin".

BEST Inc.

BEST Opens Training Center in Detroit MI

Industry News | 2015-03-27 11:48:42.0

Troy MI is the newest home for BEST solder training and certification. It purchased the license for the Detroit market which coincides with the constant addition of more electronic sensors, controllers for engines and transmissions and safety sessions.

BEST Inc.

Multitest's UltraFlat™ Process Meets Requirements of High Parallel Vertical Probe Card Applications

Industry News | 2012-01-05 19:20:11.0

Multitest announces that its UltraFlat™ process meets the requirements of high parallel vertical probe card applications.

Multitest Elektronische Systeme GmbH

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

Industry News | 2018-02-19 13:46:00.0

BTU International will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.

BTU International

BTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan

Industry News | 2017-08-26 20:24:13.0

BTU International today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

BTU International

Achieve Optimal Uniformity with BTU's TrueFlat Technology at SEMICON Taiwan

Industry News | 2023-09-04 14:03:03.0

BTU International, Inc. will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.

BTU International


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