Industry News: flex and bga (Page 12 of 32)

Colonial Circuits Acquires the New Chemcut Etcher and Developer

Industry News | 2012-06-27 14:15:24.0

Mark Osborn, President and Owner of Colonial Circuits announced recently that his company has acquired and installed Chemcut’s SA2330D Developer and SA2320 Alkaline Etcher in their facility as part of their on-going initiative to upgrade their facility to handler HDI and Micro via technologies.

Colonial Circuits, Inc.

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket

Industry News | 2003-07-08 09:09:15.0

Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz

Aries Electronics Inc

One Minute to Understand AXI and Utilize It for Free

Industry News | 2019-08-15 07:31:59.0

AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.

Elecrow

See Super PCB and Southwest Systems Technology at SMTA Austin Expo

Industry News | 2019-10-08 14:59:10.0

Super PCB is pleased to announce that its representative Southwest Systems Technology, Inc. will represent the company at the 2019 SMTA Austin (CTEA) Expo & Tech Forum, scheduled to take place Tuesday, Oct. 15, 2019 at the Norris Conference Center in Texas. Southwest Systems will discuss Super PCB’s single layer, two-layer, multilayer rigid PCBs, flex PCBs, rigid flex PCBs, Aluminum PCBs for LED and Rogers PCBs for RF applications, HDI and more.

Super PCB

PNC Inc.’s BGA Assembly

Industry News | 2017-03-23 11:33:40.0

Outline of PNC Inc's BGA assembly capabilities.

PNC Inc.

SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste

Industry News | 2015-10-13 19:27:42.0

SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void (

Shenmao Technology Inc.

Juki Automation Systems and Storage Solutions Accept a 2015 Editor’s Choice Award

Industry News | 2015-11-14 13:59:43.0

Juki Automation Systems announce that the companies were awarded a joint 2015 Editor’s Choice Award from Global SMT & Packaging magazine for the new ISM UltraFlex 3600. The award was presented to the companies during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during Productronica. The ISM UltraFlex 3600 adds a tier on top of the current lineup offered by Storage Solutions and Juki.

Juki Automation Systems

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

Summit Interconnect Acquires Royal Circuit Solutions and Affiliates

Industry News | 2022-05-04 20:38:03.0

The combination solidifies Summit's position as one of the largest privately owned printed circuit board (PCB) manufacturers in North America with a footprint that will now encompass eight manufacturing facilities. The acquisition significantly broadens the scope of Summit's product offering while expanding the company's business portfolio of key customers and end-markets.

Royal Circuit Solutions, Inc.


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