Industry News: flex and bga (Page 2 of 34)

SMT mounter Feeder common types and classification from KINGSUN

Industry News | 2023-08-17 14:26:37.0

Today, KINGSUN shares with you the common types and classifications of SMT mounters.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2017-06-08 15:11:11.0

The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

Design Innovations and Best Practices Featured at IPC APEX EXPO 2011

Industry News | 2011-01-27 15:53:22.0

Providing the latest information on design innovations and best practices, the IPC Designers Forum and several design-focused educational programs and activities will be held at IPC APEX EXPO 2011, April 10–14, 2011, in Las Vegas.

Association Connecting Electronics Industries (IPC)

SMTA Boston Offers Flip Chip and BGA Workshop

Industry News | 2003-03-20 09:03:05.0

Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.

Surface Mount Technology Association (SMTA)

SMTA Boston Workshop, Courses, and Special Events

Industry News | 2003-04-21 09:12:57.0

June 9-11 at the Bayside Convention Center

Surface Mount Technology Association (SMTA)

Now Available: Amendments for J-STD-001F and IPC-A-610F

Industry News | 2016-01-17 19:26:58.0

In order to keep up with industry demand, IPC has released amendments for J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610F, Acceptability of Electronic Assemblies. For each standard, IPC-A-610F Amendment 1 and IPC J-STD-001F Amendment 1 represents a critical shift to deliver necessary updates to these already robust standards.

Association Connecting Electronics Industries (IPC)

IPC-4204A Provides Guidance on High Speeds and Fine Lines

Industry News | 2012-06-01 13:55:57.0

As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges

Association Connecting Electronics Industries (IPC)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Industry News | 2020-08-28 03:07:38.0

ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.

ITW EAE


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