Industry News | 2010-08-27 07:25:03.0
Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.
Industry News | 2012-07-26 14:56:08.0
VJ Electronix, Inc. announces that company President Don Naugler will present at the upcoming “Sharpening Your Tools-Area Array Technology” symposium hosted by BEST, Inc.
Industry News | 2023-09-25 18:29:12.0
PDR is pleased to announce its participation in the SMTA Guadalajara Expo, scheduled to take place Wednesday, Oct. 25, 2023 in SMTVYS Technology's Booth 505 at Expo Guadalajara in Guadalajara, Jalisco. PDR is set to showcase its cutting-edge IR-E3 Series of SMD/BGA IR rework systems, as well as its industry-leading X-ray solutions.
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2009-12-14 20:45:09.0
December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2001-01-17 10:55:46.0
Valor Computerized Systems announced that Flextronics has purchased its engineering products for advanced DFM and machine programming. Both the Enterprise 3000 DFM verification products and Trilogy 5000 CAM and machine optimization systems for electronics assembly and test will be located on a central server and implemented by all Flextronics Product Introduction Centers and manufacturing sites worldwide via a global licensing agreement.
Industry News | 2016-08-17 20:25:59.0
Unicomp Technology Co. Ltd., Wuxi China, has recently opened a showroom and service support center in Oceanside, CA. The 6,000 ft.2 facility includes stencil cleaning equipment and a wide range of X-ray machines for PCB assembly and fabrication, semiconductor, battery and public security scanning. Machines for demonstration are listed below:
Industry News | 2017-05-01 15:30:04.0
PDR is pleased to announce that Horizon Sales will discuss the IR-E6 Evolution XL rework system at the SMTA Michigan Expo & Tech Forum, scheduled to take place Thursday, May 11, 2017 at the Crossroads Conference Center in Grand Rapids, MI. Horizon Sales is PDR’s exclusive representative in the Midwestern U.S. The PDR IR-E6 SMD/BGA rework station, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
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