Industry News | 2010-03-27 19:03:08.0
BANNOCKBURN, Ill., USA, - Following a year of active engagement with Congress and Department of Defense (DoD) policy makers, IPC and the IPC PCB Executive Agent Task Force members' are pleased to see their efforts are having a noticeable effect. Two recently released reports from the DoD and the U.S. Commerce Department emphasize the government’s growing awareness of the importance of the U.S. printed circuit board industry in protecting national security.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2001-03-22 14:11:23.0
Virginia Democratic Gubernational candidate Mark Warner recently visited printed circuit board (PCB) manufacturer and IPC member Printed Circuit Solutions Manufacturing (PCSM), in Galax, Virginia.
Industry News | 2017-06-08 15:11:11.0
The SMTA is pleased to announce that the program for the SMTA International Conference and Exhibition is finalized and available on-line at www.smta.org/smtai and registration is open. Taking place September 17-21, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois, the conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry.
Industry News | 2001-02-13 08:23:07.0
IPC has announced the release of The 2000/2001 National Technology Roadmap for Electronic Interconnections. This roadmap provides a vision and direction for product development, process development and services required to satisfy the current and future needs of companies building electronic equipment.
Industry News | 2010-04-10 02:16:34.0
IPC has released the E revision of IPC-A-610, Acceptability of Electronic Assemblies. IPC's most widely-used standard, which provides visual acceptance criteria for post assembly mechanical and soldering assembly requirements, now addresses additional technologies, including flexible circuits, board in board, package on package, depanelization and additional SMT terminations.
Industry News | 2011-03-31 12:37:40.0
IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2011-01-05 15:13:37.0
IPC announced the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
Industry News | 2011-07-27 22:00:17.0
IPC announced today the June findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.
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