Industry News: flex circuit bend radius (Page 1 of 2)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

Flex Interconnect Technologies’ CEO Discusses Routing in the 3D World during IPC Design Council Meeting

Industry News | 2013-07-09 16:18:50.0

Flex Interconnect Technologies (FIT) announces that its CEO Chetan Shah recently held a successful presentation for the Silicon Valley Chapter of the IPC Designer Council.

Flex Interconnect Technologies

Why do you need Stiffeners on Flex PCB?

Industry News | 2019-11-05 22:16:43.0

Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.

Headpcb

Molex Copper Flex Products Invests in AOT

Industry News | 2006-11-09 12:31:53.0

NOVEMBER 9, 2006

Lloyd Doyle

Seica Announces new Video for Rapid H4 Flex Prober

Industry News | 2020-07-22 04:00:43.0

OUR FULL TEST LINE SOLUTION FOR REEL TO REEL MARKET

SEICA SpA

A-Laser to Exhibit Flex Services at APEX 2010

Industry News | 2010-03-22 14:01:54.0

BEAVERTON, OR — March 2010 —A-Laser, a division of FCT Assembly and a premier laser cutting service specializing in the ablation of ultra-thin metals and plastics, announces it will exhibit its Flexible Circuit Processing services in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

FCT ASSEMBLY, INC.

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Industry News | 2013-02-08 23:26:44.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.

Zymet, Inc

Würth Elektronik offers the best contact between flex-rigid PCBs and ZIF connectors

Industry News | 2010-05-05 23:20:11.0

Niedernhall – PCB specialist Würth Elektronik once again demonstrates its competence in system solutions and customer support; now offering one-stop flex-rigid PCB solutions with ZIF contacts and custom designed ZIF connectors.

Würth Elektronik GmbH & Co. KG

Conductive Compounds Announces Formable Conductive Inks for Molded Plastic Assemblies

Industry News | 2012-07-31 15:57:01.0

Printable, formable conductive inks that can be applied to a flat plastic substrate and then molded into various shapes offer exciting new opportunities to engineers and designers trying to incorporate internal electronic circuitry into molded automotive and aircraft interior parts, as well as a wide variety of industrial and consumer electronic assemblies...

Conductive Compounds, Inc.

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Midwest Circuit Technology
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