Industry News | 2003-05-09 08:35:07.0
Bringing the board experience more in line with its business objectives
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
Industry News | 2016-02-25 14:36:24.0
IPC — Association Connecting Electronics Industries® has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, Calif. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Industry News | 2016-12-18 13:51:15.0
Representatives of industry’s leading manufacturers, machine, device, sensor and software companies that comprise IPC’s 2-17 Connected Factory Initiative Subcommittee have made significant strides in developing a machine data interface standard, “Connected Factory Exchange or CFX” that would enable manufacturers, equipment, device and software suppliers to achieve Industry 4.0 benefits.
Industry News | 2017-10-17 18:53:50.0
A new report published this week by IPC, Trends in the North American Market for PCB Prototypes, reveals cycles in demand for PCB prototypes that often differ from demand trends in regular or volume-production PCB sales. Despite high volatility in prototype sales from month to month, the IPC data show clear cycles in prototype sales growth, year over year. Rigid PCB and flexible circuit prototype sales do not always reflect growth in the rigid PCB and flexible circuit markets overall.
Industry News | 2019-08-21 16:21:55.0
The SMTA will organize the “Additive Electronics Conference: PCB Scale to IC Scale” on October 24, 2019 at the DoubleTree by Hilton San Jose in San Jose, California. The conference examines the manufacturing and design processes enabling line width and space from .003" to 5 microns as well as other new advanced technologies intended to meet the ever-increasing challenges of smaller, lighter and more powerful electronic devices.
Industry News | 2019-09-13 14:36:50.0
L Shaped and flat rack trays hold 30 and 25 boards.
Industry News | 2017-12-06 14:07:47.0
SMTA announced that the program is finalized for the 23rd Annual Pan Pacific Microelectronics Symposium. The event will take place February 5-8, 2018 at the Hapuna Beach Prince Resort on the Big Island of Hawaii. The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
