Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2023-09-25 20:04:34.0
Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.
Industry News | 2015-06-18 17:55:13.0
Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
Industry News | 2006-09-12 13:19:59.0
ENDICOTT, NY, September 12, 2006
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
Industry News | 2022-08-14 14:12:26.0
Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.
Industry News | 2011-09-01 22:08:39.0
Essemtec will exhibit Swiss Made, highly flexible SMD placement systems for prototyping and low volumes at the upcoming SMTA Long Island Expo and Technical Forum.
Industry News | 2021-01-17 17:50:26.0
The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.
Industry News | 2021-11-14 21:01:12.0
Productronica 2021 is an innovative, unrivaled, and international event. This is one of its kind of events that showcase the entire value chain in the production industry of electronic goods – from technology and components to software and services, including supply chain, Stencil Screen Printer, Pick & Placer, SPI, Reflow over, X-Ray inspection, BGA repair and maintenance. As an international trade fair, Productronica Munich 2021 covers the entire range of present and futuristic products, technologies, and system solutions.
