Industry News | 2007-10-04 17:14:39.0
Tempe, AZ - September 24, 2007 - FINETECH announces that it will demonstrate the Fineplacer� CRS 10 compact rework system in booth 210 at the upcoming SMTA International exhibition, scheduled to take place October 9-10, 2007 in Orlando, FL.
Industry News | 2007-10-23 16:19:57.0
Tempe, AZ - October 23, 2007 - FINETECH will demonstrate its fixed configuration, complete rework system, at the upcoming Nepcon East exhibition on October 30-31, 2007 at the Boston Convention Center.
Industry News | 2008-09-16 12:35:27.0
Tempe, AZ - FINETECH will exhibit the FINEPLACER� CRS 10 Compact Rework System in booth #809 at IPC Midwest 2008, scheduled for September 24-25, 2008 in Schaumburg, IL.
Industry News | 2009-03-10 14:58:48.0
FINETECH will showcase the Direct Component Print Module at APEX 2009 (Booth #2059), scheduled for March 31 � April 2, 2009, at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2008-02-28 15:40:26.0
Tempe, AZ - January 2008 - FINETECH will display the Fineplacer� CRS 10 Compact Rework System in booth #577 at APEX 2008, scheduled for April 1-3, 2008 in Las Vegas.
Industry News | 2009-09-23 21:53:53.0
Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.
Industry News | 2015-04-15 19:00:42.0
Rocket EMS today announced it has further enhanced its already impressive rework and special project capabilities with the purchase of the AIR-VAC DRS27 Large Format BGA Rework Station. The DRS27 provides Rocket EMS with unparalleled precision and flexibility for rework and assembly of BGAs, QFNs, CSPs, flip chips, PoP assemblies, 01005s and more.
Industry News | 2008-04-07 21:09:26.0
FINETECH announces that it will display the FINEPLACER� Lambda system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China. This high precision bonder provides a placement accuracy of � 0.5 micron.
Industry News | 2009-09-18 10:24:30.0
Tempe, AZ - FINETECH will exhibit the FINEPLACER® CRS 10 rework system in booth 322 at the upcoming SMTA International, scheduled for October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA. The system will demostrate rework of 0201 passives, BGA‘s, and QFN devices, as well as residual solder removal.
Industry News | 2022-09-14 11:09:23.0
Indium Corporation's Evan Griffith, product specialist for semiconductor and advanced assembly materials, will host a webinar about the fundamentals of flip-chip bonding at 10 a.m. New York, Thursday, Sept. 15, as part of the company's webinar program--the InSIDER Series.
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