Industry News: flip chip alignment (Page 12 of 60)

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Industry News | 2009-12-22 10:09:22.0

Pressurex® Sensor Film Needed to Measure Contact Pressure Variations Across Flip Chip Dies and Bonding Tools

Sensor Products Inc.

Bonding Flip Chips on to Flexible Circuit Boards

Industry News | 2011-01-18 13:46:21.0

Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.

Würth Elektronik GmbH & Co. KG

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Industry News | 2013-01-04 08:55:03.0

Finetech will showcase the sub-micron placement accuracy FINEPLACER® Lambda bonder

Finetech

High Accuracy Die Bonder on Display at IMAPS 2009

Industry News | 2009-10-16 19:21:16.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

Finetech

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

FINETECH to Debut Core Rework System at APEX 2010

Industry News | 2010-03-24 14:46:21.0

FINETECH will debut the new FINEPLACER Core rework system in booth #2329 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.

Finetech

In-Line Flip Chip Cleaning Now Available With AAT'S New HydroJet Flip Chip Inline Cleaner

Industry News | 2001-08-24 10:09:50.0

Austin American Technology has successfully qualified and is now introducing an automated cleaning and drying system based on its highly successful Mach I and Mach III Series HydroJet Inline Cleaner. Advances and improvements in the configuration of the system have given it the ability to efficiently clean and thoroughly dry delicate Flip Chip assemblies at in-line speeds.

Austin American Technology

Finetech Sells 12 Bonding Systems to University Labs to Advance Research

Industry News | 2011-06-01 23:22:00.0

Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.

Finetech

VJ Technologies to Showcase VJE Summit 1100HR at Productronica 2007

Industry News | 2007-11-01 01:45:16.0

LITTLETON, MASS. - VJ Electronix Inc., the leader in X-ray inspection technology and rework systems, announces that it will display the Summit 1100HR high-performance, semiautomatic rework system in their distributor, Ryonics� Stand 324 in Hall A5 at the upcoming Productronica 2007 trade show and exhibition, scheduled to take place November 13 to 16, 2007, at the Munich Trade Fair Center in Munich, Germany.

VJ Electronix

VJ Electronix to Feature Summit 1800A at APEX 2008

Industry News | 2008-03-20 16:08:23.0

LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit the Summit 1800A advanced rework system in booth 648 at the upcoming IPC APEX exhibition and designers summit, scheduled to take place April 1-3, 2008, in Las Vegas, NV

VJ Electronix


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