Industry News | 2010-01-07 20:09:26.0
FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.
Industry News | 2010-03-24 14:46:21.0
FINETECH will debut the new FINEPLACER Core rework system in booth #2329 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.
Industry News | 2001-08-24 10:09:50.0
Austin American Technology has successfully qualified and is now introducing an automated cleaning and drying system based on its highly successful Mach I and Mach III Series HydroJet Inline Cleaner. Advances and improvements in the configuration of the system have given it the ability to efficiently clean and thoroughly dry delicate Flip Chip assemblies at in-line speeds.
Industry News | 2023-03-06 17:22:53.0
ZESTRON, is pleased to announce that Senior Application Engineer, Ravi Parthasarathy, will present a technical study, "Defluxing of Copper Pillar Bumped Flip Chips" at the International Microelectronics Assembly and Packaging Society's (IMAPS) Device Packaging Conference on Tuesday, March 8th. His presentation is part of the Fan-Out, Wafer Level Packaging & Flip Chip Track Session TP2: WLP & Flip Chip: Process & Materials (2:00 – 5:30 pm)
Industry News | 2024-02-12 13:43:22.0
SHENMAO Technology is pleased to announce the availability of its latest innovation, the SMF-D61 Low Residue No-Clean Flip Chip Flux. This advanced flux is meticulously engineered to meet the demanding requirements of flip chip dipping applications, offering exceptional performance and reliability throughout the soldering process.
Industry News | 2011-06-01 23:22:00.0
Finetech announces that it sold 12 bonding systems within the past year to prominent university labs and research centers. Of the 12, three systems were purchased by California universities, including a Nanofabrication Facility as well as Electrical Engineering and Physics departments.
Industry News | 2007-11-01 01:45:16.0
LITTLETON, MASS. - VJ Electronix Inc., the leader in X-ray inspection technology and rework systems, announces that it will display the Summit 1100HR high-performance, semiautomatic rework system in their distributor, Ryonics� Stand 324 in Hall A5 at the upcoming Productronica 2007 trade show and exhibition, scheduled to take place November 13 to 16, 2007, at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-03-20 16:08:23.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit the Summit 1800A advanced rework system in booth 648 at the upcoming IPC APEX exhibition and designers summit, scheduled to take place April 1-3, 2008, in Las Vegas, NV
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2016-06-22 16:15:35.0
KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.
