Industry News: flip chip alignment (Page 10 of 64)

Vertical Circuits and Asymtek Enable Next-Generation 3D Interconnect Technology

Industry News | 2008-07-24 17:38:17.0

Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.

ASYMTEK Products | Nordson Electronics Solutions

Best Technical Papers at IPC APEX EXPO 2022 Selected

Industry News | 2022-01-14 17:06:40.0

Expanded technical conference award categories include NextGen and Student Research

Association Connecting Electronics Industries (IPC)

PCBA Cleaning Machine

Industry News | 2022-10-12 11:23:36.0

In the SMT industry, there are many types of cleaning machines. According to the cleaning things, there are stencil cleaner, PCBA cleaner, Wave Oven Pallet/Fixture cleaner, Mis-Print PCB cleaner, Squeegee cleaner, Nozzle cleaner, PCB surface cleaner and so on.

Dongguan Intercontinental Technology Co., Ltd.

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

Advances in Thin, 3D and MEMS Die Bond Strength Testing

Industry News | 2017-08-02 07:12:18.0

As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:

XYZTEC bv

ESSEMTEC to Display EXPERT-SAFP Prototyping Station at APEX 2008

Industry News | 2008-03-20 16:10:40.0

Essemtec will showcase EXPERT-SAFP universal prototyping station in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG

ESSEMTEC to Feature EXPERT-SAFP Prototyping Station at SMTA International 2008

Industry News | 2008-08-07 11:52:44.0

Essemtec will display EXPERT-SAFP universal prototyping station in booth 211 at the upcoming SMTA International 2008 exhibition and conference, scheduled to take place August 19-20, 2008, in Orlando, FL.

ESSEMTEC AG

ESSEMTEC to Feature EXPERT-SAFP Prototyping Station at IPC Midwest 2008

Industry News | 2008-09-12 03:27:20.0

Essemtec will display EXPERT-SAFP universal prototyping station in booth 907 at the upcoming IPC Midwest exhibition & conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.

ESSEMTEC AG

ESSEMTEC to Highlight EXPERT-SAFP Prototyping Station at APEX 2009

Industry News | 2009-03-19 15:08:37.0

Essemtec will feature EXPERT-SAFP universal prototyping station in booth 243 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

ESSEMTEC AG

One Minute to Understand AXI and Utilize It for Free

Industry News | 2019-08-15 07:31:59.0

AXI is short for automated X-ray inspection, it's one of the most commonly used approaches for defect inspection in PCB Assembly.

Elecrow


flip chip alignment searches for Companies, Equipment, Machines, Suppliers & Information

Blackfox IPC Training & Certification

Easily dispense fine pitch components with ±25µm positioning accuracy.
SMT feeders

Component Placement 101 Training Course
convection smt reflow ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Selective soldering solutions with Jade soldering machine

High Throughput Reflow Oven