Industry News: flip-chip machine (Page 1 of 13)

University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

SMTnet

Count On Tools Introduces Universal Instruments’ GSM Special Low Force Nozzle with Replaceable Tips for Delicate Components

Industry News | 2010-05-20 12:47:37.0

GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.

Count On Tools, Inc.

Blind and Buried Via Boards

Industry News | 2018-10-18 11:14:24.0

Blind and Buried Via Boards

Flason Electronic Co.,limited

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Practical Components to Highlight Latest Technology at SMTA International 2007

Industry News | 2007-10-04 23:11:30.0

LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.

Surface Mount Technology Association (SMTA)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

New development from the SIPLACE Technology Network - The new SIPLACE CA application: Die-bonding and SMD placement in a single machine

Industry News | 2009-05-29 12:27:20.0

Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.

Siemens Process Industries and Drives

SIPLACE participates in industry recovery

Industry News | 2010-06-18 07:36:04.0

Successful SMT/Hybrid/Packaging show

Siemens Process Industries and Drives

Yamaha Motor IM America Announces New President, GM

Industry News | 2016-05-16 21:36:36.0

Yamaha Motor IM America, Inc. announces the promotion of Mr. Takashi Kimura to the position of President, Yamaha Motor Intelligent Machinery America (YIMA).

Yamaha Motor IM America, Inc.

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