Industry News | 2016-08-30 14:34:00.0
Indium Corporation experts will deliver several technical presentations at the 37th International Electronics Manufacturing Technology and 18th Electronics Material & Packaging Conference (IEMT-EMAP 2016), Sept. 20-22, in Penang, Malaysia.
Industry News | 2017-08-14 19:16:34.0
Kurtz Ersa North America announces plans to exhibit in Booth #335 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope and i-CON VARIO 4.
Industry News | 2021-05-04 11:27:33.0
The Murray Percival Company today announced the sale of a Kurtz Ersa HR-550 BGA Rework System to Acromag, Inc.
Industry News | 2022-08-14 14:12:26.0
Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.
Industry News | 2003-04-07 13:08:13.0
Cookson Electronics Equipment Announces Camalot XYFLEXPRO Microdot Dispensing Capabilities
Industry News | 2004-09-27 17:12:27.0
High-Resolution X-Ray Inspection Under $60K
Industry News | 2010-01-11 15:10:30.0
Manncorp has introduced seven new electronic assembly turnkey lines with throughput rates ranging from prototyping to 10,500 cph. The lines are described at www.manncorp.com/turnkey and according to CEO Henry Mann, are targeted to “OEMs and others who are considering turning away from outsourcing by bringing PCB assembly in-house for the first time. The systems are also beamed to existing assemblers who wish to upgrade to latest-generation equipment.”
Industry News | 2010-05-04 08:04:45.0
After the highly successful introduction of its SIPLACE SX1 and SX2 placement machines featuring swappable gantries (“Capacity-on-Demand”), Siemens Electronics Assembly Systems will unveil the new SIPLACE SX4 at the SMT/Hybrid/Packaging trade show in Nuremberg, Germany (June 6-8, 2010; Hall 7, Booth 204).
Industry News | 2013-04-08 13:46:37.0
Kyzen Corporation announces that Debbie Carboni will present “Removal of Flux Residues from Highly Dense Assemblies” at IMAPS NE 40th Symposium & Expo on Tuesday, May 7, 2013 at the Holiday Inn Conference Center in Boxborough, MA.
Industry News | 2014-04-10 10:17:27.0
AI Technology has just increased its manufacturing capacity to more than 10 million square feet of its 10 micron thick ESP7660 series of insulating DAF for memory stacked chip applications and its 20 micron thick ESP8660 series of conductive DAF for power devices.
