Industry News: flow solder hole fill (Page 14 of 19)

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

Balver Zinn Group’s 396-DRX No-Clean VOC-Free Flux Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:36:53.0

Breda, Holland - Cobar BV, a member of the Balver Zinn Group, announces that it has been awarded a Global Technology Award in the category of Flux for its Cobar 396-DRX, a new VOC-Free Flux. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

Cobar Solder Products Inc.

FCT Assembly to Showcase Comprehensive Product Line and have Major Presence at SMTA International

Industry News | 2015-09-01 13:01:04.0

FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of products at SMTA International 2015 (www.smta.org/smtai/), as well as take part in the conference program and live process demonstrations on the show floor.

FCT ASSEMBLY, INC.

MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference in Shenzhen

Industry News | 2020-08-22 04:19:37.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.

MacDermid Alpha Electronics Solutions

Essemtec to Debut Smart Solution Concept and 3D MID Production Line at Productronica

Industry News | 2013-10-08 16:27:28.0

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its newest machines in Hall A3, Stand 341 at the 20th international productronica international trade fair, scheduled to take place November 12 - 15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

ESSEMTEC AG

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

SMART Group Hosts Successful “Back to Basics” Rework & Inspection Workshop

Industry News | 2013-04-03 18:52:22.0

SMART Group,announces that on 26th March 2013, more than 30 delegates from manufacturing and service repair sectors, including line managers, process and quality engineers, attended its successful “Back to Basics” Hands-on Rework and Inspection Workshop at the Manufacturing Technology Centre in Coventry, UK

The SMART Group

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

Visit SHENMAO at the SMTA Long Island Conference & Exhibition

Industry News | 2019-10-08 06:05:58.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Thursday, October 17, 2019 at the Melville Marriott in Melville, NY. The company will showcase its PF735-PQ10 low temperature solder (LTS) and SM-862 Liquid Flux.

Shenmao Technology Inc.

Nihon Superior to Introduce Complete Range of SN100C Soldering Materials at Internepcon Japan 2008

Industry News | 2007-12-05 22:55:10.0

OSAKA, JAPAN � December 4, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth EAST6 59-18 at the upcoming Internepcon Japan exhibition, scheduled to take place January 16-18, 2008 at the Tokyo Big Sight Exhibition Center, Japan.

Nihon Superior Co., Ltd.


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