Industry News: flow solder hole fill (Page 16 of 19)

YINCAE Launches Breakthrough Thermal Underfill: UF 158A2

Industry News | 2023-03-27 14:51:47.0

We are thrilled to announce that YINCAE has some exciting news to share with you! We have recently introduced a breakthrough technology - thermal underfill UF 158A2 which can dramatically shorten the manufacturing process and improve the heat dissipation.

YINCAE Advanced Materials, LLC.

ACD Acquires a PSA N2-GEN® Series Pressure Swing Adsorption Nitrogen Generator

Industry News | 2012-08-01 17:06:10.0

ACD, recently installed a PSA N2-GEN® Series Pressure Swing Adsorption (PSA) Nitrogen Generator from South-Tek Systems. Dee Claybrook of Southwest Systems Technology, Inc. assisted with the purchase of the system, which will enable ACD to reduce its Nitrogen costs by up to 90 percent

Automated Circuit Design (ACD)

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

Nihon Superior�s SN100C Wins Two 2008 NPI Industry Awards

Industry News | 2008-04-07 22:33:54.0

OSAKA, JAPAN � March 31, 2008 � Nihon Superior Co. Ltd., an advanced lead-free soldering materials to the global electronics industry announces that it has been awarded two 2008 NPI Awards with the Balver Zinn Balver Zinn Group (Balver Zinn, Nihon Superior Co. Ltd., FCT Assembly and DKL Metals) in the category of Soldering Materials and Flux for its innovative SN100C Paste. The awards were presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

Nihon Superior Co., Ltd.

How to Solder a Surface Mount Device to a PCB Pad

Industry News | 2018-10-18 09:02:41.0

How to Solder a Surface Mount Device to a PCB Pad

Flason Electronic Co.,limited

DEK unlocks productivity advantage for Nepcon Shanghai visitors

Industry News | 2010-04-14 20:57:38.0

From the recently re-energized Horizon platform, through to comprehensive print process control tools and next-generation stencil technologies, the DEK display at Nepcon Shanghai will treat booth visitors to the ultimate in print productivity. Being held from 20th – 22nd April at the Everbright Convention & Exhibition Centre, the twentieth Nepcon Shanghai event will see DEK demonstrate a selection of advanced products and processes from booth 1E08.

ASM Assembly Systems (DEK)

All about Semiconductor

Industry News | 2018-12-08 03:37:02.0

All about Semiconductor

Flason Electronic Co.,limited

SEHO to Showcase Comprehensive Lineup of Cost-Effective Soldering Equipment Solutions at Productronica

Industry News | 2009-12-08 16:29:21.0

KREUZWERTHEIM, GERMANY ? October 2009 ? SEHO Systems GmbH will once again prove why it’s a leading worldwide soldering provider, with an all-inclusive lineup of equipment solutions at this year’s Productronica 2009. SEHO’s comprehensive soldering equipment display can be found in Hall A4 Stand 460 of the event, which is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

SEHO Systems GmbH

Nihon Superior to Introduce Complete Range of SN100C Soldering Materials at APEX 2008

Industry News | 2008-03-15 15:22:12.0

OSAKA, JAPAN � March 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 249 at the upcoming APEX exhibition and conference, scheduled to take place April 1-3, 2008 in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Newly Expanded Range of SN100C Soldering Materials at Mexitr�nica 2008

Industry News | 2008-10-07 20:52:28.0

OSAKA, JAPAN � October 2008 � Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., an advanced soldering supplier to the worldwide market, announces that it will feature a newly expanded range of SN100C products, which includes new halogen-free solder paste, in booth 402 at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008 at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

Nihon Superior Co., Ltd.


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