Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2011-01-12 14:24:53.0
The Balver Zinn Group announces that Cobar Europe BV will exhibit a completely new range of high-performance low-VOC and VOC-free fluxes at the upcoming Pan Pacific Microelectronics Symposium & Tabletop Exhibition, scheduled to take place January 18-20, 2011at the Hapuna Beach Prince Hotel on the Big Island of Hawaii.
Industry News | 2011-03-11 14:58:49.0
The Balver Zinn Group announces that Cobar Europe BV will exhibit a complete new range of high-performance low-VOC and VOC-free fluxes in Booth #371 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2010-12-01 15:39:40.0
Krayden introduces the Circalok 6008 Potting Compound by LORD, a filled low viscosity epoxy resin for general purposes such as an encapsulating and potting compound for electronics.
Industry News | 2007-10-29 17:10:53.0
Aesch/Switzerland � Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will highlight the CDS6700 dispenser with the new piezo flow valve for solder paste dispensing in booth A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2012-07-25 15:16:14.0
The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2015-05-26 21:36:49.0
Japan Unix announces a speed upgrade to its flash soldering Unix FS Series. The innovative flash soldering laser system is two times faster than a typical laser and can integrate pre- and post-soldering processes such as surface mount and through-hole devices. In addition to increasing speed, the Series can improve productivity.
Industry News | 2020-08-11 15:03:44.0
Advanced Assembly today announced the installation of its new selective solder machine, the Juki iCube. This new robust system provides the company with a unique ability to perform selective soldering on through-hole mounted components faster and with more repeatability than before.
Industry News | 2013-01-12 12:12:07.0
Speedline Technologies - Electrovert announces that all wave soldering machines sold after November 1, 2012 will carry a lifetime warranty on the solder pot casting. The lifetime warranty applies to the original purchaser.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
