Industry News | 2023-02-13 15:36:40.0
ZESTRON is pleased to announce a new product to the market, VIGON® NX 728. A water-based, pH neutral defluxing agent formulated for PCB assemblies with low-standoff components.
Industry News | 2006-12-08 00:56:55.0
Clinton, NY
Industry News | 2012-03-05 13:30:41.0
Kyzen has been awarded a 2012 NPI Award in the category of Cleaning Materials for its AQUANOX® A4638 Advanced Packaging Cleaning Chemistry. This marks the company's fifth consecutive NPI Award in the Cleaning Materials category.
Industry News | 2018-10-18 09:33:23.0
wave soldering has become the future direction of development
Industry News | 2016-11-01 19:35:47.0
Sono-Tek Corporation (OTC BB: SOTK) today announced the hire of Alex Papa to the position of Jr. Sales Engineer in its Electronics & Advanced Energy division. Papa holds a BS in Mechanical Engineering from Binghamton University in NY. His technical background is an important asset to Sono-Tek’s sales team, and, combined with his excellent communication skills, brings instant value to Sono-Tek’s ability to provide superior support for both customers and reps in the field.
Industry News | 2010-09-02 10:50:13.0
SEHO Systems GmbH announces that it will highlight its SelectiveLine in booth 7719 at the upcoming IPC Electronics Midwest Conference & Exhibition, scheduled to take place September 28-30, 2010 at the Donald E. Stevens Convention Center in Rosemont, IL.
Industry News | 2011-03-14 17:39:45.0
BTU International will debut its new dual-lane, dual-speed capabilities of the PYRAMAX™ solder reflow system, as well as a next generation flux management system.
Industry News | 2012-06-26 13:57:31.0
SEHO Systems GmbH announces that it will highlight its best-selling selective soldering system, the PowerSelective, at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, July 12, 2012 from 10 a.m.-3 p.m. at the Doubletree Hotel in Independence (Cleveland), OH.
Industry News | 2018-10-22 18:35:12.0
SHENMAO Technology today announced plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place Oct. 23-25, 2018 at the DoubleTree by Hilton San Jose in California. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys.
Industry News | 2019-08-12 20:00:01.0
SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”
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