Industry News: flux plus (Page 1 of 6)

SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award

Industry News | 2017-09-16 02:29:39.0

Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.

Heller Industries Inc.

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announce Panel Discussion on Electronic Fluid Designs

Industry News | 2008-09-02 17:41:24.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Bill Kenyon will moderate a collaborative panel discussion on cleaning fluid designs. The panelists will comprise industry experts including Dr. Ken Dishart formerly of DuPont, Karl Manske of 3M, Tom Tattersall of MicroCare, Kyle Doyel of Kyzen, Dr. Harald Wack of Zestron, and Dr. Jay Soma of Petroferm. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Surface Mount Technology Association (SMTA)

IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium Announces Panel Discussion on Electronic Equipment Designs

Industry News | 2008-09-29 09:33:53.0

ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dave Torp, IPC Vice President of Technology and Standards, will moderate a collaborative panel discussion on cleaning equipment designs. The panelists will comprise cleaning equipment experts including Steve Stach of Austin American Technology, Mike Konrad of Aqueous Technologies, Jim Timler of Steolting/Trek, John Neiderman of Speedline Technologies, Roger Travato of Technical Devices, and Eric Larson of Crest Ultrasonic. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC Midwest Conference & Exhibition

Industry News | 2012-03-09 17:47:15.0

IPC has issued a Call for Participation for the technical conference at IPC Midwest Conference & Exhibition™. The one show in the Midwest focused on printed boards and electronics manufacturing, this year’s event will take place August 22–23, 2012, at the Renaissance Schaumburg Convention Center in Schaumburg, Ill. Researchers, academics, technical experts and industry leaders are invited to submit abstracts on the materials and processes that contribute to the performance of printed board assemblies.

Association Connecting Electronics Industries (IPC)

SMTA Announces February Webinars and Webtorials

Industry News | 2010-01-22 21:46:55.0

Minneapolis, MN - The SMTA is pleased to announce several new online presentations coming up in February. In response to industry-wide budget cuts and travel restrictions, SMTA has committed to increasing its online programming to better accommodate member needs for technical exchange.

Surface Mount Technology Association (SMTA)

Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards

Industry News | 2020-01-29 07:33:26.0

IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.

Association Connecting Electronics Industries (IPC)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

BEST SMT Boot Camp Nov 29-Dec 1, 2016 Featuring Phil Zarrow

Industry News | 2016-10-25 09:47:33.0

Learn about SMT assembly from SME Phil Zarrow in Chicago

BEST Inc.

New Underfill from Zymet for 0.4-mm pitch POP's

Industry News | 2012-01-13 13:20:53.0

Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.

Zymet, Inc

BTU International to Exhibit New Features of PYRAMAX Solder Reflow Oven at NEPCON South China 2011

Industry News | 2011-08-22 17:33:19.0

BTU International will showcase its new Dual Lane Dual Speed capabilities of the PYRAMAX™ solder reflow system, as well as next-generation HE Flux Management, in Booth #1F42 at the upcoming NEPCON South China 2011.

BTU International

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