Industry News: flux recommendations (Page 1 of 8)

Debbie Carboni, KYZEN Corporation, to Present at SMTA Capital Chapter Meeting on June 10th

Industry News | 2021-05-25 12:56:56.0

The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:

Surface Mount Technology Association (SMTA)

Indium Corporation Expands Fine Wire Capabilities

Industry News | 2022-01-29 13:28:14.0

Indium Corporation has expanded its manufacturing capabilities to include a fine diameter 0.004" (0.10mm) flux-cored wire made with select Pb-free alloys to help customers meet the progressively demanding requirements of fine-pitch applications.

Indium Corporation

Balver Zinn Group’s Area Sales Manager to Present at IPC Standard Workshop in Russia

Industry News | 2014-08-25 21:13:55.0

The Balver Zinn Group announces that Han Raetsen, Area Sales & Support Manager, will present at the IPC Standard and Electronic Manufacturing workshop and seminar. Raetsen will present, "Mixed Technology: The impact of using a SnPb soldering material in combination with Pb-free components", and "Reliability of Fluxes in Selective Soldering Applications."

Cobar Solder Products Inc.

AIM Solder’s Karl Seelig to Present during S12 Technical Session at IPC APEX 2013

Industry News | 2013-01-18 16:47:20.0

AIM Solder announces that its VP of Technology Karl Seelig will present his paper titled “Conformal Coating Over No-Clean Flux” at the upcoming IPC APEX Expo

AIM Solder

Indium Corporation Releases New Water-Soluble Solder Paste Indium6.4R

Industry News | 2015-09-29 22:17:04.0

Indium Corporation's Indium6.4R is a versatile, water-soluble solder paste flux that enables a low cost of ownership for PCB assembly customers through an all-around, balanced performance.

Indium Corporation

YINCAE's New NC 256 Zero Residue Flux

Industry News | 2019-08-19 15:02:03.0

YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC.

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Indium Corporation Announces Karch as Regional Technical Manager for Germany, Austria and Switzerland

Industry News | 2016-04-22 14:45:12.0

Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.

Indium Corporation

Indium Corporation's Proven Jetting Paste Recommended by NSWAutomation

Industry News | 2020-12-03 13:07:26.0

Indium Corporation's newest jetting and microdispensing solder paste, Indium12.8HF, has been officially recommended by NSWAutomation for use with their newest microfluid dispenser, SD1.

Indium Corporation

StenTech to Showcase Stencils & Tooling at the SMTA Silicon Valley Expo

Industry News | 2022-11-21 16:03:53.0

StenTech Inc. will showcase its new Advanced Nano Coating at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Thursday, Dec. 8, 2022 in Sunnyvale, California. Additionally, the company will display its complete line of various stencils and tooling.

Stentech


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