Industry News | 2024-03-18 12:30:34.0
Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, will exhibit in Booth #1332 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in Calif. The COT team will focus on its core product lines at the show:
Industry News | 2018-01-18 04:01:33.0
Cobar Solder Products Inc. part of the Balver Zinn Group announces that it will exhibit together with Amerway Inc. in Booth #2502 at the IPC APEX EXPO, scheduled to take place February 27 – March 1, 2018 at the San Diego Convention Center, California.
Industry News | 2019-11-05 22:23:45.0
The basic principle of a press-fit connection is that a contact terminal is pressed into a printed circuit board (PCB). There are two types of press-fit pins – the solid pin with a solid press-in zone and the compliant pin with an elastic press-in zone. In this article, we’ll discuss the elastic press-in zone.
Industry News | 2015-04-21 16:57:06.0
The Balver Zinn Group announces that they will be attending SMT/Hybrid/Packaging 2015 scheduled to take place May 5-7 in Nuremberg, Germany. They will highlight the company’s latest solder flux and paste technology in Booth #7-308.
Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2023-05-22 18:45:34.0
SHENMAO America, Inc. is proud to announce the release of its new SMBF-08 Visible No-Clean BGA Flux. This innovative flux is specifically designed to meet the demands of surface mount technology (SMT) assembly and BGA ball mount processes, offering enhanced visibility and performance.
Industry News | 2011-04-20 20:31:30.0
FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2022-10-06 18:52:04.0
KYZEN will exhibit at the SMTA Long Island Expo & Tech Forum, scheduled to take place Wednesday, October 19, 2022 at the Marriott Melville in Melville, NY. The KYZEN team will discuss how its AQUANOX® A4639, CYBERSOLV 141-X and MICRONOX MX2501 can solve individual cleaning challenges.
