Industry News: foot-print (Page 1 of 3)

InDigiNet To Acquire 2.5million in Assets

Industry News | 2003-05-08 07:11:45.0

InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.

SMTnet

PROMATION RELEASES SMALL FOOT PRINT LINE LOADING

Industry News | 2006-03-09 06:52:49.0

KENOSHA, WI � March 9, 2006 PROMATION announced that is has developed a small foot print Line Loading station that incorporates both a Bare PCB Loader and a Magazine Line Loader into the same work cell.

PROMATION, Inc.

PROMATION Completes Major Installation for Medical Device Company

Industry News | 2015-06-12 09:23:50.0

Kenosha, WI — June 11, 2015 — A leader in the field of PCB Handling Equipment and Robotic Soldering Systems PROMATION Inc. announced it has just completed its second line installation for a major medical device manufacturer.

PROMATION, Inc.

WAFER HANDLING SOLUTIONS FOR 200 MM & 300 MM PLATFORMS

Industry News | 2005-12-20 10:08:07.0

PROMATION has developed a line of 200 mm and 300 mm wafer handling systems for loading the line and unloading the line.

PROMATION, Inc.

EASYBRAID CO. INTRODUCES SEC'S X-EYE MICRO 3D CT X-RAY SYSTEM

Industry News | 2012-09-18 08:38:00.0

EasyBraid Co., the North American channel for SEC X-ray, is proud to introduce the X-Eye Micro 3D CT X-ray System. This is the latest product offering in SEC's world-class 3D CT X-ray line.

EasyBraid Co.

YINCAE's New NC 256 Zero Residue Flux

Industry News | 2019-08-19 15:02:03.0

YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC.

In-Line Flip Chip Cleaning Now Available With AAT'S New HydroJet Flip Chip Inline Cleaner

Industry News | 2001-08-24 10:09:50.0

Austin American Technology has successfully qualified and is now introducing an automated cleaning and drying system based on its highly successful Mach I and Mach III Series HydroJet Inline Cleaner. Advances and improvements in the configuration of the system have given it the ability to efficiently clean and thoroughly dry delicate Flip Chip assemblies at in-line speeds.

Austin American Technology

Mentor Graphics Enables Smart Device Development for M2M Applications with Support for Zero Configuration Networking

Industry News | 2012-12-20 18:06:04.0

Mentor Graphics announced a solution to design network-based devices for machine-to-machine (M2M) and smart energy applications with the latest release of the Mentor® Embedded Nucleus® Real Time Operating System (RTOS) platform.Nucleus RTOS.

Mentor Graphics

EVS International Picks up a 2013 NPI Award for Its EVS 10K Solder Recovery System

Industry News | 2013-02-20 07:27:11.0

EVS International announces that it has been awarded a 2013 NPI Award in the category of Soldering – Other for its EVS 10K Solder Recovery Machine.

EVS International

Austin American’s NanoJetTM Aqueous Inline Cleaning System Takes New Product (NPI) Award at APEX 2013

Industry News | 2013-03-26 23:33:20.0

AAT's new Nanojet™ won a coveted New Product Introduction (NPI) Award, which was presented to Steve Stach, President, on February 19 at IPC/APEX 2013 in San Diego, California. The annual award recognizes innovative and industry-leading new products in electronics manufacturing.

Austin American Technology

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