Industry News: fr5 glass transition (Page 1 of 7)

IPC Releases E-Textiles Standard IPC-8921

Industry News | 2020-01-07 11:09:15.0

IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.

Association Connecting Electronics Industries (IPC)

Raw Material Choices for PCBs

Industry News | 2018-10-18 11:10:33.0

Raw Material Choices for PCBs

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Isola Expands Commercial Production of I-Speed(R) PCB Materials Into Asia

Industry News | 2013-12-18 15:18:53.0

Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.

Isola Group

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-05-07 16:11:10.0

AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.

AI Technology, Inc. (AIT)

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

Engineered Material Systems Releases Die Attach for Light Emitting Diodes and Small Power Semiconductor Devices

Industry News | 2012-02-15 19:12:30.0

Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost Jettable Conductive Adhesive for Photovoltaic Stringing and Bussing Applications

Industry News | 2013-06-24 10:34:13.0

Engineered Material Systems (EMS), debuts its CA-148 Jettable Conductive Adhesive for ribbon stringing and bussing in photovoltaic applications.

Engineered Materials Systems, Inc.

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Industry News | 2013-09-24 14:26:38.0

Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Industry News | 2013-10-22 14:45:08.0

Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

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