Industry News: frame thickness (Page 2 of 3)

DEK and CHAD to Demonstrate Enhanced Thin Wafer Capabilities at Semicon West

Industry News | 2009-06-23 20:26:31.0

Debuting its most recent technology advance, mass imaging leader DEK will showcase the company’s new thin wafer processing expertise from booth #811 at the upcoming Semicon West event in San Francisco, California. A full line solution that incorporates a Galaxy Thin Wafer System and a next-generation CHAD WaferMate™ wafer handler, this latest development resolves traditional challenges associated with high-speed handling and processing of thinned wafers on a proven print platform.

ASM Assembly Systems (DEK)

Accu-Assembly Inc. Introduces Vertical, Modular SMT Component Reel Storage & Retrieval System

Industry News | 2023-04-24 19:30:41.0

Accu-Assembly Inc. is pleased to introduce the AccuLiFT SMT component reel vertical modular storage and retrieval system. With quick and easy changeover, the AccuLiFT's flexible reel configuration enables small and large reels to be interchanged at any position on the pallet.

Accu-Assembly Inc.

DEK Unveils Large Print Area Photon Platform at Nepcon Shanghai

Industry News | 2008-03-24 22:24:18.0

World leading screen printing and mass imaging specialist DEK is to unveil a large area version of its Photon print platform at Nepcon Shanghai. Called the Photon Vi, the new machine offers substrate printing to 24" x 24" (610mm x 610mm) on demand to meet the diverse volume, mix and size requirements of modern production environments.

ASM Assembly Systems (DEK)

Blue Thunder Technologies to Showcase ESD Products at SMTA International 2008

Industry News | 2008-08-07 14:42:08.0

EAST WINDSOR, CT � August 2008 � Blue Thunder Technologies Inc., a manufacturer of high-quality wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, announces that it will feature its friendly green� wipes, THE AQUAVATORTM stencil wiping fabric, the Green Monster stencil wiping roll and antistatic wipes in booth 302 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.

Blue Thunder Technologies, Inc.

CyberOptics to Discuss Tool Qualification Capabilities of WaferSense® Airborne Particle Sensor at Semicon West 2012

Industry News | 2012-05-09 15:50:19.0

CyberOptics Semiconductor (www.CyberOpticsSemi.com) will discuss the tool qualification features of its WaferSense® Airborne Particle Sensor (APS) as it is used to measure the presence and density of airborne particles inside fab tools during Semicon West

CyberOptics Corporation

Nordson DAGE and Nordson YESTECH to Display Market Leading AOI, Bond Test and X-ray Inspection Systems at NEPCON South China

Industry News | 2014-07-30 12:10:12.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), announce they will exhibit in Booth # A-1H30 at NEPCON South China, scheduled to take place August 26-28, 2014 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Nordson DAGE

INDUSTRY RECOGNIZES PANASONIC FACTORY SOLUTIONS WITH TWO NPI AWARDS

Industry News | 2015-03-17 10:32:36.0

March 17, 2015 – Rolling Meadows, IL – Panasonic Factory Solutions Company of America has won two New Product Introduction (NPI) Awards for its newly introduced NPM-D3 component placement machine and Multi Recognition Camera. The awards were accepted by the company’s president, Faisal Pandit, at a ceremony during IPC APEX in San Diego, CA. Mr. Pandit commented, “Panasonic Factory Solutions is honored to receive these awards as testament to our deliberate focus to be the best total solutions provider—delivering hardware, software, and process solutions emphasizing continuous improvement and innovation.”

Panasonic Factory Solutions Company of America (PFSA)

Revolutionary AOI, AXI and & Bondtesting from Nordson at NEPCON South China

Industry News | 2017-08-03 06:15:05.0

Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand 1H20 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. Test and inspection solutions from Nordson DAGE, Nordson MATRIX and Nordson YESTECH will be demonstrated at the event.

MARCH Products | Nordson Electronics Solutions

Saki Corporation Introduces Automated X-ray Inspection for IGBT Power Modules at Productronica Stand A2.259

Industry News | 2019-11-12 12:31:32.0

Expands Saki's Lineup of Compact, Lightweight, Ultra-High-Speed Inline 3D CT Automated X-ray Inspection Systems

SAKI America

New Yorker Electronics Introduces New Family of ECE Flex Cable Connectors

Industry News | 2020-12-18 11:15:50.0

New Excel Cell Electronic ZIF Type Board-to-FPC Connectors are used in Medical Ventilators, Computers, and Security Applications

New Yorker Electronics


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