Industry News | 2014-02-03 14:07:15.0
ISVI Corp. announces the signing of a distribution agreement with TechwaY S.A.S. to address the French machine market’s need for high-speed, high-resolution cameras.
Industry News | 2009-07-17 19:06:05.0
Minneapolis, MN – As this year marks the 25th Anniversary of the founding of the Surface Mount Technology Association, the SMTA is holding a very special celebration to recognize the amazing support received from the industry over the years. SMTA is commemorating the occasion with a special website, recognizing luminaries, and hosting a dinner and celebration at its annual event, SMTAI International.
Industry News | 2013-11-15 18:02:04.0
ISVI Corp. will show its latest CoaXPress cameras together with its Distribution Partner, SYMCO Corporation of Tokyo, Japan, at the ITE Yokohama 2013 Vision Show from 4-6 December at the Symco Booth Hall D #54. By showing their cutting-edge technologies, ISVI and Symco will demonstrate how easy it is to integrate the CoaXPress interface into all high-speed and high-resolution applications including AOI, SPI and semiconductor inspection.
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2013-07-01 19:34:57.0
The decision of who will be the Opening Keynote at IPC APEX EXPO® 2014, March 25–27 in Las Vegas, is being put to a vote.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2018-10-18 08:29:16.0
How to Prevent Short Circuits to Ground in QFN Components?
Industry News | 2019-05-27 21:12:34.0
IPC's Validation Services Program has awarded an IPC-A-610 and IPC J-STD-001 Qualified Manufacturers Listings (QML) Class 3 and IPC J-STD-001 Space QML, to Tempo Automation for its location in San Francisco, Calif.
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
