Industry News: fuji part data (Page 13 of 118)

IPC Developing Best Industry Practices for Intellectual Property Protection — Seeks Industry Input

Industry News | 2010-03-17 18:22:21.0

BANNOCKBURN, Ill., USA, March 16, 2010 — The IPC Intellectual Property Committee will release its first draft of a standard for the protection of intellectual property (IP) designed into printed circuit boards at an open meeting, Tuesday, April 6, 2010, at IPC APEX EXPO® in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC Study Identifies Costs of SEC Conflict Minerals Due Diligence at 17 Times More than Government Estimates

Industry News | 2011-03-11 14:53:57.0

A new study conducted by IPC — Association Connecting Electronics Industries® predicts that reporting requirements for conflict minerals proposed by the U.S. Security and Exchange Commission (SEC) would cost the electronic interconnect industry an estimated $279 million in the first year of implementation for due diligence alone, compared to the government’s estimate of $16.5 million.

Association Connecting Electronics Industries (IPC)

New IPC-9708 Standard Fills the Void in Test Methods for Pad Cratering

Industry News | 2011-03-31 11:54:23.0

Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter to Host Second Meeting of the Year on May 28th at NTS Baltimore on “Failure Analysis Process for Printed Board Assemblies” by John M. Radman

Industry News | 2015-05-18 21:29:50.0

The SMTA Capital Chapter is pleased to announce its second meeting of 2015 on May 28th, scheduled from 5:30 pm to 8:00 pm at NTS Baltimore formerly Trace Labs, 5 North Park Drive, Hunt Valley, MD 21030. The focus of this chapter meeting will be “Failure Analysis Process for Printed Board Assemblies” presented by John M. Radman, Senior Applications Engineer, NTS Baltimore.

Surface Mount Technology Association (SMTA)

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Industry News | 2024-03-26 13:55:04.0

Today's system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industry Results For November 2010

Industry News | 2011-01-05 15:13:37.0

IPC announced the November findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industry Results for January 2011

Industry News | 2011-03-02 17:08:18.0

IPC announced today the January findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

IPC Releases PCB Industry Results for February 2011

Industry News | 2011-03-31 12:37:40.0

IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

VOLUNTEERS HONORED FOR CONTRIBUTIONS TO ELECTRONICS INDUSTRY AND IPC More than 150 awards presented at IPC APEX EXPO 2014

Industry News | 2014-03-28 09:54:48.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)


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