Industry News | 2012-08-01 16:59:34.0
How can you prepare new product introductions more effectively, create error-free placement programs and make sure that even the first batch of a product is produced with maximum quality?
Industry News | 2016-09-07 12:47:48.0
ADLINK Technology announces its new MXC-6400 Series of high-performance expandable fanless embedded computers, featuring 6th generation Intel® Core™ i7/ i5/ i3 processors (codename Skylake) and the QM170 chipset. Along with leading performance, high storage density from 4x 2.5" SATA drives, and rugged fanless construction withstanding operating shock up to 50G and vibration to 5Grms, the MXC-6400 Series fully meets the needs of Intelligent Transportation Systems for rolling stock, maritime operations, in-vehicle infotainment, and high-speed data processing and mission-critical industrial automation.
Industry News | 2001-08-01 16:07:13.0
Image Processing Libraries Add Enhancements for Rapid Application Development and High-Speed Performance
Industry News | 2009-08-25 19:45:15.0
bm-papst, one of the world’s leading manufacturers of fans, has implemented the SIPLACE Facts manufacturing execution system (MES) from Siemens Electronics Assembly Systems GmbH (SEAS) at its plant in Mulfingen, Germany.
Industry News | 2014-11-04 17:37:56.0
ADLINK Technology today announced the release of its latest industrial ATX motherboard, the IMB-M42H, featuring the 4th Gen Intel® Core™ i7/i5/i3/Pentium®/Celeron® Processor family and Intel® H81 chipset. The IMB-H42H supports integrated motion/vision application-based platforms with a leading price/performance ratio. Combined high-bandwidth PCIe x16, PCIe x4 and conventional PCI slots, superior and rugged I/O connectivity and optimal design make it an optimum solution for industrial automation applications.
Industry News | 2017-08-16 13:53:55.0
ADLINK Technology has introduced its MVP-6010/6020 Series, a new addition to its MVP family of value-priced fanless embedded computing platforms. The MVP-6010/6020 Series, with four expansion slots, not only surpasses expectations for conventional industrial PCs, but also provides a perfect balance between features and performance in a compact size, all at an exceptionally cost effective price point.
Industry News | 2015-03-23 12:27:07.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization. The Package Integrator solution automates planning, assembly and optimization of today’s complex multi-die packages. It incorporates a unique virtual die model concept for true IC-to-package co-optimization. In support of early marketing-level studies for a proposed new device, users can now plan, assemble and optimize complex systems with minimal source data. The new Package Integrator flow allows design teams to realize faster and more efficient physical path finding and seamless tool integration for rapid prototyping, right to the production flow.
Industry News | 2022-03-29 07:16:39.0
Viscom AG continues its success story in the field of manual and automated X-ray inspection (3D-MXI) with a new high-quality system: like its predecessor X8011-II PCB, the X8011-III offers outstanding flexibility in inspection tasks and extremely high resolutions – plus brilliant and highly detailed image quality.
Industry News | 2005-12-13 18:58:01.0
ENR Top 500 National Design Firm Uses PowerCAD� SiteMaster� 2 �Point-Shoot-Done� Laser-Based Mobile Field Solution To Finish 2.1 Million Square Foot US Navy Building Surveying Project More Than 30 Days Ahead Of Schedule
Industry News | 2005-12-13 18:58:10.0
ENR Top 500 National Design Firm Uses PowerCAD� SiteMaster� 2 �Point-Shoot-Done� Laser-Based Mobile Field Solution To Finish 2.1 Million Square Foot US Navy Building Surveying Project More Than 30 Days Ahead Of Schedule
