Industry News: full material declarations (Page 3 of 149)

MIRTEC Announces Technical Collaboration Agreement with YXLON and The Comet Group

Industry News | 2018-08-21 20:05:28.0

MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.

MIRTEC Corp

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Industry News | 2017-04-24 19:04:48.0

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2020

Industry News | 2020-01-06 16:06:59.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.

MIRTEC Corp

InDigiNet To Acquire 2.5million in Assets

Industry News | 2003-05-08 07:11:45.0

InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.

SMTnet

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

Baja Bid Auctions SMT Equip from Siemens, Teradyne, & More

Industry News | 2013-12-03 10:29:06.0

Baja Bid announces their next online auction. This exchange auction includes equipment from several companies throughout the United States and Canada with the majority of the items located at the OSI Electronics site in North Andover, Massachusetts.

Baja Bid

Clariant turns the spotlight on 3D printed end use functional parts and new material for mobility and E&E trends at formnext 2019

Industry News | 2019-11-15 15:07:04.0

As intelligent industrial manufacturing gains a stronger foothold in production alongside the more established customization/prototyping arenas, Clariant returns to this year’s formnext with new solutions to support the growth. A new halogen-free flame retardant 3D printing material takes center stage alongside eye-catching and unique printed end use parts from a range of applications.

Clariant Cargo & Device Protection

Alberi EcoTech and PTC Lead IPC Committee Responsible for Supplier Declaration Standards

Industry News | 2011-08-22 20:30:30.0

In an era of intense scrutiny over “what” materials are used in electronic products and “from where” those materials originate, Krista Crotty, founder of Alberi EcoTech, and Jørgen Vos, product management director at PTC, have accepted the co-leadership roles of IPC’s 2-18 Supplier Declaration Subcommittee.

Association Connecting Electronics Industries (IPC)

New IPC-1758 Data Exchange Standard on Pack and Packing Materials Provides Consistency, Efficiency and Integrity to Declaration Process

Industry News | 2012-07-12 16:39:49.0

— IPC — Association Connecting Electronics Industries® has released IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials.

Association Connecting Electronics Industries (IPC)

Chemical Reporting for Article Products and IPC-1754

Industry News | 2020-06-18 14:18:29.0

Obtaining data from the supply chain to support chemical ("substance") content reporting for article (hardware) products remains extremely challenging and resource-intensive for industries such as Aerospace and Defense (AD). However, the increasing use of materials and substances declaration standards promotes efficiency in obtaining such data. IPC and IAEG® (International Aerospace Environmental Group) encourage the use of IPC-1754, Materials and Substances Declaration for Aerospace and Defense and Other Industries in the AD industry and its global supply chain.

Association Connecting Electronics Industries (IPC)


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