Industry News | 2003-06-19 08:13:11.0
The new heads are capable of reaching an acceleration of greater than 20g.
Industry News | 2003-04-14 09:02:03.0
The stock will be eligible to trade on the Over the Counter Bulletin Board (OTCBB) under the ticker symbol �DDIC� as early as April 15, 2003, provided a market maker enters a quote for the security.
Industry News | 2003-04-04 08:46:37.0
Company Announces Further Reductions to Goodwill and Reclassifications of Indebtedness Recorded in Fiscal 2002
Industry News | 2017-11-07 16:56:11.0
IPC — Association Connecting Electronics Industries® has released the G revisions of the two most widely used standards in the electronic industry, IPC-J-STD-001, Requirements of Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. These two documents are on a three-year renewal cycle, keeping pace with the everchanging technology within the electronics industry.
Industry News | 2020-03-25 11:52:54.0
IPC announces the release of IPC J-STD-001GA/IPC-A-610GA, Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies. The addendum is a first-of-a-kind document that requires the use of both J-STD-001 and IPC-A-610 along with requirements in the addendum, as it looks at the whole of the electronics assembly manufacturing process from assembly to inspection addressing board reliability requirements for the automotive industry.
Industry News | 2018-09-23 09:57:15.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place November 13-15, 2018 at Chicago Marriott, Schaumburg, Illinois. The conference is focused on the cleanliness of highly dense electronic assemblies to achieve quality and reliability within the stated in-field environment.
Association Connecting Electronics Industries (IPC)
Industry News | 2020-02-18 14:13:29.0
Michael Ford, Dale Lee, Joe O’Neil and S. Manian Ramkumar honored for their on-going leadership in IPC and the electronics industry
Industry News | 2004-09-07 18:32:13.0
NORTHBROOK, Ill., September, 2004
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
