Industry News | 2011-01-18 13:46:21.0
Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.
Industry News | 2013-09-10 15:43:26.0
HARTING AG is increasingly using 3-D molded interconnect device (MID) technology for its customers in the automotive and medical technology sectors who demand very high quality.
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