Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2013-05-01 12:45:51.0
Held at the Rijckholt Castle and Nordson ASYMTEK European Headquarters in Maastricht
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2013-05-14 12:32:32.0
The Coalition for the Advancement of MicroElectronic Systems Technology (CAMEST),will hold its initial planning meeting and charter development May 21 during the IPC Electronic Systems Technologies Conference (IPC ESTC) at The New Tropicana in Las Vegas.
Industry News | 2014-09-06 19:09:28.0
IPC — Association Connecting Electronics Industries® has begun work on an in-depth study of the region’s labor pool.
Industry News | 2013-06-20 19:24:42.0
IPC – Association Connecting Electronics Industries® has released the agenda for IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, an event designed to help the PCB supply chain and chip manufacturers better meet industry demands for reliability and performance.
Industry News | 2013-09-06 15:42:34.0
IPC – Association Connecting Electronics Industries® announces its online store is selling the 2013 Roadmap from the International Electronics Manufacturing Initiative (iNEMI) through a special agreement between the two organizations.
Industry News | 2016-03-18 11:49:32.0
On Wednesday, March 16, at IPC APEX EXPO, IPC’s 2-13 Shop Floor Communications Subcommittee brought together leading software developers, machine vendors, assembly equipment manufacturers and their customers to work on development of a new IPC standard to meet the current and future needs of industry that will fill a gap identified by the group. This new standard will provide uniformity of data protocols that will allow ease of machine to machine communication.
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
