Industry News: glass (Page 10 of 35)

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Industry News | 2013-10-22 14:45:08.0

Engineered Material Systems debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Introduces Low-Cost, Snap Cure Conductive Adhesive for Die Attach Applications

Industry News | 2014-01-07 18:42:22.0

Engineered Material Systems debuts its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Engineered Material Systems Debuts Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications

Industry News | 2014-02-11 15:25:57.0

Engineered Material Systems introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

Engineered Materials Systems, Inc.

Isola Expands Production of GETEK Materials in Germany to Support European OEMs

Industry News | 2014-02-18 10:31:01.0

Isola Group S.à r.l. announced today that GETEK® laminates and prepegs are now in production at its facility in Düren, Germany, which will shorten lead times to Isola's European customers.

Isola Group

Engineered Material Systems Debuts DF-4017 Hydrophobic Dry Film Negative Photoresist

Industry News | 2014-05-05 16:29:24.0

Engineered Material Systems, Inc. (EMS) introduces the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS).

Engineered Materials Systems, Inc.

Staticide® Is Now Available in Aerosol Form

Industry News | 2014-07-07 15:51:16.0

By customer demand, ACL Incorporated's long-lasting topical anti-stat, Staticide®, is now available as an aerosol spray as Static Sentry.

ACL Staticide, Inc.

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-04-22 11:52:53.0

Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Industry News | 2018-03-12 17:42:02.0

Engineered Material Systems is pleased to debut its DA-6010 Non-Conductive Die Attach Adhesive designed for image sensor attach or chip on board applications.

Engineered Materials Systems, Inc.

Achieve Higher Productivity at a Lower Cost with Anda’s In-Line AP-460 Atmospheric Plasma Cleaning Machine

Industry News | 2018-03-29 07:09:21.0

Anda Technologies USA removes all impurities and contaminants (including dust, grease and dirt, as well as static electricity), improving surface area adhesion.

Anda Automation Pte Ltd

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Industry News | 2018-12-08 03:27:35.0

Printed Circuit Board (PCB) for Surface Mount Technology (SMT)

Flason Electronic Co.,limited


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