Industry News: glue (Page 3 of 17)

Dispensing function now integrated in the VERSAPRINT

Industry News | 2011-02-09 14:43:39.0

If up to now a separate dispenser had to be deployed to set glue dots or to add additional solder paste to a board assembly, it is now possible to use this function within the stencil printer itself.

kurtz ersa Corporation

High-Speed Pick-and-Place System Features New Dispenser Option

Industry News | 2012-06-25 12:57:32.0

New extension for Paraquda SMD placement machine released A new precision dispenser option allows the Paraquda high-speed pick-and-place from Essemtec to dispense up to 20,000 glue or paste dots per hour.

ESSEMTEC AG

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Industry News | 2017-07-27 13:42:24.0

Essemtec today announced plans to exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2 that combines jetting of solder paste or glue and placement in a single machine.

ESSEMTEC AG

Henkel Launches New Fast Cure Silicone Ideal for Added Stability within Harsh Environments

Industry News | 2008-04-22 21:03:49.0

To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.

Henkel Electronic Materials

Essemtec’s FLX2011-MK Places Smaller Components on Flexible Circuits

Industry News | 2009-07-17 19:02:35.0

The FLX2011-MK, Essemtec’s production center for flexible circuits and membrane keyboards, is now equipped with a jet valve dispensing system, allowing it to place smaller SMD components and LEDs on flexible circuits. The jet valve dispenses small glue dots more accurately and faster than others, and is contactless.

ESSEMTEC AG

Essemtec Highlights 3-in-1 Multi-Functional SMT Center Paraquda at Automaticon 2015

Industry News | 2015-02-16 09:46:54.0

At the upcoming AUTOMATICON 2015 exhibition, taking place March 17 - 20 in Warsaw, Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will highlight its award-winning Paraquda in booth B28, hall 1. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and/or glue and mount components in one machine.

ESSEMTEC AG

InspectoScan C A new way of looking at things

Industry News | 2013-12-12 17:23:04.0

The InspectoScan C automates the inspection of conformal coatings, through hole solder joints, edge connectors, mechanical parts, wiring, glue, and many other types of component.

CGI Americas

Production cell for flexible PCB

Industry News | 2005-03-18 12:10:43.0

New pick & place series FLX2010-MK (MK=Membrane Keyboard)

ESSEMTEC AG

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Industry News | 2017-08-17 12:11:00.0

Essemtec today announced plans to exhibit in Booth #207 at SMTA International. The company will demonstrate the new FOX2 that combines jetting of solder paste or glue and placement in a single machine.

ESSEMTEC AG


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