Industry News | 2013-12-12 17:23:04.0
The InspectoScan C automates the inspection of conformal coatings, through hole solder joints, edge connectors, mechanical parts, wiring, glue, and many other types of component.
Industry News | 2005-03-18 12:10:43.0
New pick & place series FLX2010-MK (MK=Membrane Keyboard)
Industry News | 2017-08-17 12:11:00.0
Essemtec today announced plans to exhibit in Booth #207 at SMTA International. The company will demonstrate the new FOX2 that combines jetting of solder paste or glue and placement in a single machine.
Industry News | 2005-12-15 11:50:05.0
Best Cleaning Material
Industry News | 2008-11-12 20:09:45.0
November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.
Industry News | 2012-01-21 00:27:35.0
Speedprint Technology will debut the SP710avi to the North American market in Booth #3015 at the upcoming IPC APEX Expo.
Industry News | 2012-03-09 16:34:49.0
ASYS Group started their 20 Year Celebration of Transforming Ideas Into Solutions at the Apex Show with new product introductions and trip giveaways to visit the company’s headquarters in Germany for their Technology Days in November. ASYS congratulates the three lucky winners of the Daily Trip Giveaway to Germany.
Industry News | 2012-08-03 08:37:31.0
Speedprint Technology will exhibit in booth 805 at the upcoming IPC Midwest Exhibition & Conference
Industry News | 2012-09-13 07:33:14.0
Speedprint Technology will exhibit in booth 622 at the upcoming SMTA International Conference and Expo
Industry News | 2017-02-21 15:59:49.0
Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.
