Industry News | 2017-08-08 09:40:33.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2017-08-08 09:40:36.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2021-01-19 22:00:27.0
The temperature of the neutral particles is close to room temperature, which provides suitable conditions for improving the surface of the thermosensitive polymer. Through low-temperature plasma surface treatment, many physical and chemical changes occur on the surface of the material, or etching occurs, or a dense cross-linked layer is formed, or an oxygen-containing polar group is introduced to make it hydrophilic, adhesive, and dyeable Performance, biocompatibility and electrical properties can be improved.
Industry News | 2019-01-03 01:32:10.0
User-friendly air cleaning system concept introduced
Industry News | 2021-11-22 06:30:35.0
Test Research, Inc. announces that the company's 3D SPI system, TR7007QI Plus, received a 2021 Global Technology Award.
Industry News | 2016-08-01 21:15:48.0
Vi TECHNOLOGY will exhibit with SMT Solutions in Booth A-1737 at E-16, scheduled to take place Sept. 6-8, 2016 at the Odense Congress Center in Denmark. Vi TECHNOLOGY will showcase its PI series 3D SPI and 7K DL Series.
Industry News | 2016-08-09 19:59:05.0
Saline Lectronics, Inc., a leading electronics contract manufacturer, recently installed the Stinger on its DEK Horizon 03iX printer used on a high-volume SMT Line. The company plans to add the Stinger to its other DEK printers in the future.
Industry News | 2016-09-06 16:57:50.0
Essemtec today announced plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 5-6, 2016 at Hotel Riu Guadalajara. The new FOX Compact Pick-and-Place Machine is the first machine in its class with linear motors and a mineral cast frame, providing exceptional speed, stability and accuracy, and making it perfectly suited for use in small production environments.
Industry News | 2016-10-13 13:50:57.0
Essemtec announced plans to exhibit the new FOX Compact Pick-and-Place Machine at the SMTA New England Expo & Tech Forum and the SMTA LA/Orange County Expo & Tech Forum, both on Thursday, November 3, 2016. The New England Expo will take place at the DCU Center in Worcester, MA, and the LA/Orange County Expo will take place at The Grand Event Center in Long Beach, CA. The FOX measures only 88 x 109 cm and it can accept PCBs up to 406 x 305 mm. Components with sizes from 0201 (imperial) up to 33 x 80 mm can be placed, optionally up to 80 x 80 mm.
Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
