Industry News: glue (Page 8 of 17)

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Industry News | 2017-06-25 20:23:32.0

Optimal Electronics Corporation is pleased to announce that the company provides process control and traceability solutions for clean rooms and MEMS sensor assembly. With this, the company has introduced dispense process control and traceability for Nordson ASYMTEK machines.

Optimal Electronics Corporation

SIPLACE at the 2013 APEX show SIPLACE software combined with flexible hardware makes all the difference

Industry News | 2013-01-30 17:37:16.0

After a record year, the SIPLACE team of ASM Assembly Systems wants to keep expanding its market position in North and South America

ASM Assembly Systems GmbH & Co. KG

Essemtec's Placement Machine for Flex Board and Film Substrate Features Twin Vacuum Table

Industry News | 2008-08-14 14:51:51.0

Essemtec announces that it has developed a special twin vacuum table for its placement machine FLX2011-MKL that eases the handling of flex boards and film substrates and doubles productivity.

ESSEMTEC AG

Essemtec Premiers New Pick-and-Place System for 3D-MID

Industry News | 2008-11-18 17:22:43.0

Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.

ESSEMTEC AG

DEK presents ProFlow� Evolution; extends award-winning technology's capability & process window

Industry News | 2009-04-21 12:38:53.0

Since DEK introduced its ProFlow� enclosed print head system over a decade ago, it has been recognized industry-wide for its ability to advance materials deposition applications around the world. Today, DEK has extended the capabilities and process window of its pioneering technology even further with the launch of its highly anticipated ProFlow Evolution.

ASM Assembly Systems (DEK)

New Reflow Oven Introduced by APS Novastar

Industry News | 2011-01-25 14:49:29.0

New Reflow Oven Introduced by APS Novastar - The ERO-500 Reflow Soldering System, A Five Zone, Cost-Effective Reflow Solution for Small to Medium Volume Lead-Free SMT Production and Prototyping.

DDM Novastar Inc

Essemtec Highlights SMT Highly Versatile Production on a High-Quality Level at Electronica India 2011

Industry News | 2011-08-29 16:18:01.0

Essemtec will exhibit a Swiss Made, highly flexible SMD assembly line at the upcoming electronica India 2011. The promoted turnkey line consist of a SP150-SV-PLUS high accuracy solder paste printer, a PANTERA-XV highly flexible SMD pick-and-place and a RO400-FC full convection reflow oven.

ESSEMTEC AG

Essemtec to Highlight EXPERT-SAFP with BGA Placer at SMTA Long Island Expo and Technical Forum 2011

Industry News | 2011-09-01 22:08:39.0

Essemtec will exhibit Swiss Made, highly flexible SMD placement systems for prototyping and low volumes at the upcoming SMTA Long Island Expo and Technical Forum.

ESSEMTEC AG

"Simplify Your Manufacturing Challenges" - SIPLACE at the 2012 APEX Show

Industry News | 2012-02-07 16:06:38.0

At this year’s APEX trade show, the SIPLACE team will present many innovations for its award-winning SIPLACE SX placement platform.

ASM Assembly Systems GmbH & Co. KG

Speedprint Wins a 2012 Circuits Assembly NPI Award for Its Best-in-Class Printing Technology

Industry News | 2012-02-29 20:13:27.0

Speedprint Technology announces that it has been awarded a 2012 NPI Award in the category of Screen/Stencil Printing Equipment for its SP700avi Screen Printer.

Speedprint Technology


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