Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2009-03-20 17:12:01.0
APEX, NC - March 2009 - Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will exhibit the Flexys-10 intelligent placement system in booth 473 at the upcoming APEX 2009 Conference & Exhibition that is scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2009-04-21 12:38:53.0
Since DEK introduced its ProFlow� enclosed print head system over a decade ago, it has been recognized industry-wide for its ability to advance materials deposition applications around the world. Today, DEK has extended the capabilities and process window of its pioneering technology even further with the launch of its highly anticipated ProFlow Evolution.
Industry News | 2011-01-25 14:49:29.0
New Reflow Oven Introduced by APS Novastar - The ERO-500 Reflow Soldering System, A Five Zone, Cost-Effective Reflow Solution for Small to Medium Volume Lead-Free SMT Production and Prototyping.
Industry News | 2011-08-29 16:18:01.0
Essemtec will exhibit a Swiss Made, highly flexible SMD assembly line at the upcoming electronica India 2011. The promoted turnkey line consist of a SP150-SV-PLUS high accuracy solder paste printer, a PANTERA-XV highly flexible SMD pick-and-place and a RO400-FC full convection reflow oven.
Industry News | 2011-09-01 22:08:39.0
Essemtec will exhibit Swiss Made, highly flexible SMD placement systems for prototyping and low volumes at the upcoming SMTA Long Island Expo and Technical Forum.
Industry News | 2012-02-07 16:06:38.0
At this year’s APEX trade show, the SIPLACE team will present many innovations for its award-winning SIPLACE SX placement platform.
Industry News | 2012-02-29 20:13:27.0
Speedprint Technology announces that it has been awarded a 2012 NPI Award in the category of Screen/Stencil Printing Equipment for its SP700avi Screen Printer.
Industry News | 2012-03-15 09:55:33.0
Carlsbad, CA – March 15, 2012: Machine Vision Products (MVP), a leader in Automated Optical Inspection will be demonstrating its Microelectronics AOI systems applications at Semicon China 2012 in Shanghai from March 20 – 22. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 19 years of service to the industry. MVP will be exhibiting with Teltec SemiconductorPacific Limited at Booth #4435.
Industry News | 2012-10-29 15:45:34.0
Preview for Aster Technologies, electronica 2012, Hall A1, Booth 352
