Industry News: glue dot height camalot (Page 1 of 2)

CAMALOT MicroDot Dispensing System

Industry News | 2003-04-07 13:08:13.0

Cookson Electronics Equipment Announces Camalot XYFLEXPRO Microdot Dispensing Capabilities

Phoenix United Associates, Inc.

High-Speed Pick-and-Place System Features New Dispenser Option

Industry News | 2012-06-25 12:57:32.0

New extension for Paraquda SMD placement machine released A new precision dispenser option allows the Paraquda high-speed pick-and-place from Essemtec to dispense up to 20,000 glue or paste dots per hour.

ESSEMTEC AG

World-class Dispensing in a Small Footprint

Industry News | 2020-06-11 06:23:00.0

Essemtec announces that its Spider smart-sized high-speed dispenser can be adapted for a wide range of dispensing applications including solder paste and SMT glue, LED encapsulation, silver epoxy, dam and fill, underfill, cavity fill, 3D dispensing via laser height mapping and more.

ESSEMTEC AG

Essemtec Wins 2024 Mexico Technology Award for Excellence in Dispensing Technology

Industry News | 2024-09-16 20:05:32.0

Essemtec is thrilled to announce that its New Spider High-Speed Solder Paste Jetting System has won this year's prestigious Mexico Technology Award in the Dispensing category. The award was presented during a ceremony on Wednesday, September 11, 2024, at SMTA Guadalajara in Mexico.

ESSEMTEC AG

Essemtec to Display CDS6700 Solder Paste Dispenser at Productronica 2007

Industry News | 2007-10-29 17:10:53.0

Aesch/Switzerland � Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it will highlight the CDS6700 dispenser with the new piezo flow valve for solder paste dispensing in booth A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

ESSEMTEC AG

Vi TECHNOLOGY to Present Its New 3D AOI System to the U.S. Market at APEX

Industry News | 2016-02-18 20:38:36.0

Vi TECHNOLOGY will exhibit in Booth #2534 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. For the first time in the U.S., Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

Vi TECHNOLOGY

Vi TECHNOLOGY Brings a Complete 3D Inspection Solution to 3 Booths at NEPCON S China

Industry News | 2016-07-30 19:42:12.0

Vi TECHNOLOGY will exhibit with WKK (booth 1J55), American Tec (booth 1H40) and FTCL (booth 1H50) at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

Vi TECHNOLOGY

Vi TECHNOLOGY to Present Its Complete 3D Inspection Solution at SMTAI

Industry News | 2016-08-31 19:14:17.0

Vi TECHNOLOGY will exhibit in Booth #1019 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.

Vi TECHNOLOGY

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Industry News | 2017-01-11 17:03:45.0

Essemtec today announced plans to exhibit in Booth #1223 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Essemtec will debut the FOX² and demonstrate the compact Spider jet dispenser.

ESSEMTEC AG

Essemtec Brings Paraquda 4C with PFV to SMTA International

Industry News | 2013-09-14 09:00:12.0

Essemtec will exhibit in booth #827 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

ESSEMTEC AG

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