Industry News | 2021-01-26 04:57:21.0
Plasma surface treatment equipment is one of the most effective treatment processes for surface cleaning, activation and coating. It can be used to treat various materials, including plastic, metal or glass.
Industry News | 2017-11-08 15:24:31.0
Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.
Industry News | 2017-06-25 20:23:32.0
Optimal Electronics Corporation is pleased to announce that the company provides process control and traceability solutions for clean rooms and MEMS sensor assembly. With this, the company has introduced dispense process control and traceability for Nordson ASYMTEK machines.
Industry News | 2016-02-18 20:38:36.0
Vi TECHNOLOGY will exhibit in Booth #2534 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. For the first time in the U.S., Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.
Industry News | 2016-07-30 19:42:12.0
Vi TECHNOLOGY will exhibit with WKK (booth 1J55), American Tec (booth 1H40) and FTCL (booth 1H50) at NEPCON South China, scheduled to take place Aug. 30-Sept. 1, 2016 at the Shenzhen Convention & Exhibition Center. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.
Industry News | 2016-08-31 19:14:17.0
Vi TECHNOLOGY will exhibit in Booth #1019 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Vi TECHNOLOGY will show the K Series3D, its new 3D AOI, coupled with PI series (3D SPI) and SIGMA Link, resulting in a complete 3D inspection solution.
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2013-01-30 17:37:16.0
After a record year, the SIPLACE team of ASM Assembly Systems wants to keep expanding its market position in North and South America
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2020-07-27 11:12:23.0
Columbus, Ohio - Engineered Vision announces the release of the Flex-Bot: A New Generation of Vision Flex Feeding Technology! The Flex-Bot provides a solution to a previously unsolved manufacturing dilemma of high mix part feeding. This limitation has stifled manufacturers ability to automate, leaving manual labor in charge of dull and monotonous part feeding for anything less than ultra-high volume. The Flex-Bot offers an alternative to ultra-high volume single part bowl feeders with multiple part flexibility and additional orientation capability through robotic placement. With a standard hardware and software platform, there has been a greater than 40% reduction in engineering hours required to develop a custom application, and those savings are being passed on to the customer. With the ability to quickly adapt to an immense range of parts through Vibratory & Smart Auto-Tuning Technology as well as a point and click user interface, the Flex-Bot is the solution for today's current projects and tomorrow's ambitions.
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