Industry News | 2008-01-21 13:24:32.0
Additive ECO process on bare PCB saves weeks
Industry News | 2001-02-26 11:18:45.0
Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.
Industry News | 2004-09-29 21:38:11.0
Frenchtown, NJ, September 2004
Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2007-12-06 11:45:48.0
Solid Copper Conductors are Added Between BGA Pads
Industry News | 2019-11-05 22:07:01.0
Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.
Industry News | 2011-08-19 05:08:40.0
Nickel gold is one of the most popular surface finishes used in the PCB assembly industry with many advantages but also process and reliability issues.
Industry News | 2012-08-08 17:26:00.0
Everett Charles Technologies’ (ECT) announces that it will highlight the new HyperCore Base Material
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2012-08-23 16:51:38.0
Everett Charles Technologies’ (ECT) announces that it will highlight the new HyperCore Base Material in Booth #20 at the upcoming Silicon Valley Test Workshop,
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
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