Industry News | 2021-05-04 13:53:27.0
Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2017-10-12 15:01:31.0
Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2017-05-11 13:04:23.0
PDR is pleased to announce that it now offers three versions that make up the IR-E3 Evolution Series of SMD/BGA Rework Stations. The PDR IR- E3G has been the company’s top selling station for many years, a clear preferred choice of customers worldwide. The versatile system is ideal for a very wide range of SMD/BGA/uBGA/CSP/LED applications on small-large sized PCBs. The PDR IR-E3 systems are available in three models – IR-E3S Standard, IR-E3G Gold and IR-E3M Micro Component/PCB Rework System – each configured perfectly for their respective roles.
Industry News | 2018-09-18 20:27:42.0
PDR today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will have the IR-C3 Chipmate Entry-Level SMD/BGA Rework Station and IR-E3 Evolution Series SMD/BGA IR Rework Station in Booth #527.
Industry News | 2017-03-14 10:44:55.0
Developed by XJTAG®, the free software for PADS® Schematic Design will significantly increase the Design for Test and Debug capabilities of the schematic capture and PCB design environment.
Industry News | 2007-10-23 17:27:36.0
Indium Corporation�s *Indium5.1AT Pb-Free Solder Paste *is an Award-Winning No-Clean, Pb-Free Solder Paste that delivers enhanced finished goods reliability by featuring;
Industry News | 2021-09-07 11:14:42.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
