Industry News | 2013-10-25 16:15:31.0
Barry Industries introduces a new 0904 size chip attenuator for Ku, K and Ka bands. The AV0904GA attenuator has been characterized to 30GHz, features gold wirebondable I/O terminals with epoxy mount ground pads and is rated to 750mW.
Industry News | 2011-02-24 21:14:37.0
Aegis Software will unveil its next industry-first technology in the form of the only iPad and iPhone integrated manufacturing software system for electronics assemblers. Visitors to the Aegis booth will be entered in an iPad giveaway to celebrate the ultimate factory speed, control, and visibility solution.
Industry News | 2021-05-04 13:53:27.0
Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2017-05-11 13:04:23.0
PDR is pleased to announce that it now offers three versions that make up the IR-E3 Evolution Series of SMD/BGA Rework Stations. The PDR IR- E3G has been the company’s top selling station for many years, a clear preferred choice of customers worldwide. The versatile system is ideal for a very wide range of SMD/BGA/uBGA/CSP/LED applications on small-large sized PCBs. The PDR IR-E3 systems are available in three models – IR-E3S Standard, IR-E3G Gold and IR-E3M Micro Component/PCB Rework System – each configured perfectly for their respective roles.
Industry News | 2017-10-12 15:01:31.0
Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0.
Industry News | 2018-09-18 20:27:42.0
PDR today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will have the IR-C3 Chipmate Entry-Level SMD/BGA Rework Station and IR-E3 Evolution Series SMD/BGA IR Rework Station in Booth #527.
Industry News | 2021-09-07 11:14:42.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-10-18 12:49:19.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2022-03-07 16:53:18.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
.gif)
