Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2018-12-18 20:24:14.0
The best technical conference paper of IPC APEX EXPO® 2019 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, January 29, 2019.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2018-01-16 11:59:10.0
Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.
Industry News | 2016-08-17 20:59:26.0
Conecsus will exhibit at SMTA International 2016 Conference and Exhibition, exhibiting September 27-28, 2016 in booth #818 at the Donald Stephens Convention Center in Rosemont, Illinois. Conecsus representatives will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market.
Industry News | 2016-09-14 17:53:44.0
Conecsus will exhibit at the SMTA Guadalajara Expo & Tech Forum, Wednesday October 5 and Thursday October 6, 2016, at Hotel Riu Guadalajara, Mexico. Roberto G Valenzuela Camargo will be in responsible for the booth. Conecsus representatives will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market.
Industry News | 2017-01-16 16:47:14.0
Conecsus will exhibit true metals recycling solutions that reward the recycling customer by paying cash for waste back to the customer, at IPC/APEX 2017 in San Diego, California, February 14-16. Conecsus representatives in booth #3551 will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market.
Industry News | 2017-07-19 21:24:26.0
Conecsus will be an exhibitor at the SMTA International 2017 Conference and Exhibition, September 19 and 20, 2017 in booth #1028 at the Donald Stephens Convention Center in Rosemont, Illinois. Conecsus’ representatives will illustrate how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market.
