Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-11-26 17:44:57.0
Feeder Finger announced the release of their embossed tape Finger for its key partner, Juki Automation Systems. Due to market demand, the teams at both Feeder Finger and Juki collaborated to design, build and test a finger specifically made to handle embossed tape. This product expansion is expected to garner pre-orders at SMTA International with full production available in November 2018.
Industry News | 2008-05-03 15:36:30.0
MINNEAPOLIS - May 2008 - CyberOptics Corporation (Nasdaq: CYBE) announces that it has been awarded an EMAsia Innovation Award in the category of Inspection & Testing � AOI for its Flex HR (High Resolution) AOI system. The award was presented to the company during an April 8, 2008 ceremony that took place at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China.
Industry News | 2001-11-14 10:56:35.0
MYDATA automation announces its latest innovation in surface mount technology - a feeder that tests show reduces setup and changeover times by 75 percent.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
Industry News | 2018-10-01 13:22:15.0
Epec Engineered Technologies, an industry leader in high reliability manufactured electronics, has recently announced a new version of their online circuit board quote and ordering tool, InstantPCBQuote.
Industry News | 2003-07-08 09:09:15.0
Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz
Industry News | 2013-03-28 11:03:15.0
Multitest, will present at the VOICE conference, scheduled to take place April 23-25, 2013 at the DoubleTree by Hilton Hotel in San Jose, CA. Meet Multitest’s experts to learn more about the company’s solutions, from wafer-level test to final test – for standard ICs and sensor packages.
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