Industry News | 2003-04-09 08:25:50.0
A new design guide is available from Genalog detailing Samtec's flex circuit capabilities.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2014-04-11 09:15:04.0
IPC – Association Connecting Electronics Industries®, working in partnership with the Automotive Industry Action Group (AIAG), the Conflict-Free Sourcing Initiative (CFSI) and the Japan Electronics and Information Technology Industries Association (JEITA), recently published IPC-1755, Conflict Minerals Data Exchange Standard, to help suppliers and their customers effectively facilitate conflict minerals data exchange along the entire global supply chain.
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Industry News | 2016-06-10 09:45:09.0
Cranston RI - Technic is pleased to announce the installation of the TechniPad Electroless Palladium process AT7015 at Gold Plating Services (GPS) in Santa Clara CA. GPS is a contract plating service specializing in precious metal plating for the printed circuit board industry.
Industry News | 2012-11-05 14:21:13.0
ECD is digging deep to find the oldest M.O.L.E.® so scour your plant for a vintage, working M.O.L.E.® thermal profiler and enter our contest to Win a New SuperM.O.L.E.® Gold 2 Kit
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2019-06-28 14:40:30.0
Siborg Systems Inc. gave the first viewing of LCR-Reader-MPA for the first time in Korea from May 15- 17 2019
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